Datasheet AD9271 (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | Octal LNA/VGA/AAF/ADC and Crosspoint Switch |
| Pages / Page | 60 / 10 — AD9271. ABSOLUTE MAXIMUM RATINGS. Table 4. With. Parameter. Respect To. … |
| Revision | B |
| File Format / Size | PDF / 2.1 Mb |
| Document Language | English |
AD9271. ABSOLUTE MAXIMUM RATINGS. Table 4. With. Parameter. Respect To. Rating. THERMAL IMPEDANCE. Table 5. Air Flow Velocity (m/s). θ 1. θJB
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AD9271 ABSOLUTE MAXIMUM RATINGS Table 4.
Stresses above those listed under Absolute Maximum Ratings
With Parameter Respect To Rating
may cause permanent damage to the device. This is a stress ELECTRICAL rating only; functional operation of the device at these or any AVDD GND −0.3 V to +2.0 V other conditions above those indicated in the operational DRVDD GND −0.3 V to +2.0 V section of this specification is not implied. Exposure to absolute CWVDD GND −0.3 V to +3.9 V maximum rating conditions for extended periods may affect GND GND −0.3 V to +0.3 V device reliability. AVDD DRVDD −2.0 V to +2.0 V
THERMAL IMPEDANCE
Digital Outputs GND −0.3 V to +2.0 V (DOUTx+, DOUTx−,
Table 5.
DCO+, DCO−,
Air Flow Velocity (m/s) θ 1 JA θJB θJC Unit
FCO+, FCO−) 0.0 20.3 °C/W CLK+, CLK− GND −0.3 V to +3.9 V 1.0 14.4 7.6 4.7 °C/W LI-x LG-x −0.3 V to +2.0 V 2.5 12.9 °C/W LO-x LG-x −0.3 V to +2.0 V LOSW-x LG-x −0.3 V to +2.0 V 1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad CWDx−, CWDx+ GND −0.3 V to +3.9 V soldered to PCB. SDIO, GAIN+, GAIN− GND −0.3 V to +2.0 V PDWN, STBY, SCLK, CSB GND −0.3 V to +3.9 V
ESD CAUTION
REFT, REFB, RBIAS GND −0.3 V to +2.0 V VREF, SENSE GND −0.3 V to +2.0 V ENVIRONMENTAL Operating Temperature −40°C to +85°C Range (Ambient) Storage Temperature −65°C to +150°C Range (Ambient) Maximum Junction 150°C Temperature Lead Temperature 300°C (Soldering, 10 sec) Rev. B | Page 10 of 60 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY PRODUCT HIGHLIGHTS SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS ADC TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS EQUIVALENT CIRCUITS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ULTRASOUND CHANNEL OVERVIEW Low Noise Amplifier (LNA) Active Impedance Matching LNA Noise INPUT OVERDRIVE Input Overload Protection CW DOPPLER OPERATION Crosspoint Switch TGC OPERATION Variable Gain Amplifier Gain Control VGA Noise Antialiasing Filter ADC CLOCK INPUT CONSIDERATIONS Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO Pin SCLK Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation SERIAL PORT INTERFACE (SPI) HARDWARE INTERFACE MEMORY MAP READING THE MEMORY MAP TABLE RESERVED LOCATIONS DEFAULT VALUES LOGIC LEVELS APPLICATIONS INFORMATION DESIGN GUIDELINES Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations EVALUATION BOARD POWER SUPPLIES INPUT SIGNALS OUTPUT SIGNALS DEFAULT OPERATION AND JUMPER SELECTION SETTINGS QUICK START PROCEDURE SCHEMATICS AND ARTWORK OUTLINE DIMENSIONS ORDERING GUIDE
AD9271 ABSOLUTE MAXIMUM RATINGS Table 4.
Stresses above those listed under Absolute Maximum Ratings
With Parameter Respect To Rating
may cause permanent damage to the device. This is a stress ELECTRICAL rating only; functional operation of the device at these or any AVDD GND −0.3 V to +2.0 V other conditions above those indicated in the operational DRVDD GND −0.3 V to +2.0 V section of this specification is not implied. Exposure to absolute CWVDD GND −0.3 V to +3.9 V maximum rating conditions for extended periods may affect GND GND −0.3 V to +0.3 V device reliability. AVDD DRVDD −2.0 V to +2.0 V
THERMAL IMPEDANCE
Digital Outputs GND −0.3 V to +2.0 V (DOUTx+, DOUTx−,
Table 5.
DCO+, DCO−,
Air Flow Velocity (m/s) θ 1 JA θJB θJC Unit
FCO+, FCO−) 0.0 20.3 °C/W CLK+, CLK− GND −0.3 V to +3.9 V 1.0 14.4 7.6 4.7 °C/W LI-x LG-x −0.3 V to +2.0 V 2.5 12.9 °C/W LO-x LG-x −0.3 V to +2.0 V LOSW-x LG-x −0.3 V to +2.0 V 1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad CWDx−, CWDx+ GND −0.3 V to +3.9 V soldered to PCB. SDIO, GAIN+, GAIN− GND −0.3 V to +2.0 V PDWN, STBY, SCLK, CSB GND −0.3 V to +3.9 V
ESD CAUTION
REFT, REFB, RBIAS GND −0.3 V to +2.0 V VREF, SENSE GND −0.3 V to +2.0 V ENVIRONMENTAL Operating Temperature −40°C to +85°C Range (Ambient) Storage Temperature −65°C to +150°C Range (Ambient) Maximum Junction 150°C Temperature Lead Temperature 300°C (Soldering, 10 sec) Rev. B | Page 10 of 60 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY PRODUCT HIGHLIGHTS SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS ADC TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS EQUIVALENT CIRCUITS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ULTRASOUND CHANNEL OVERVIEW Low Noise Amplifier (LNA) Active Impedance Matching LNA Noise INPUT OVERDRIVE Input Overload Protection CW DOPPLER OPERATION Crosspoint Switch TGC OPERATION Variable Gain Amplifier Gain Control VGA Noise Antialiasing Filter ADC CLOCK INPUT CONSIDERATIONS Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO Pin SCLK Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation SERIAL PORT INTERFACE (SPI) HARDWARE INTERFACE MEMORY MAP READING THE MEMORY MAP TABLE RESERVED LOCATIONS DEFAULT VALUES LOGIC LEVELS APPLICATIONS INFORMATION DESIGN GUIDELINES Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations EVALUATION BOARD POWER SUPPLIES INPUT SIGNALS OUTPUT SIGNALS DEFAULT OPERATION AND JUMPER SELECTION SETTINGS QUICK START PROCEDURE SCHEMATICS AND ARTWORK OUTLINE DIMENSIONS ORDERING GUIDE
