Datasheet HMC8121 (Analog Devices) - 3

ManufacturerAnalog Devices
Description81 GHz to 86 GHz, E-Band Variable Gain Amplifier
Pages / Page16 / 3 — Data Sheet. HMC8121. SPECIFICATIONS. Table 1. Parameter. Min. Typ. Max. …
RevisionB
File Format / SizePDF / 352 Kb
Document LanguageEnglish

Data Sheet. HMC8121. SPECIFICATIONS. Table 1. Parameter. Min. Typ. Max. Unit

Data Sheet HMC8121 SPECIFICATIONS Table 1 Parameter Min Typ Max Unit

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Data Sheet HMC8121 SPECIFICATIONS
TA = 25°C, VDDx = 4 V, VCTLx = −5 V, unless otherwise noted.
Table 1. Parameter Min Typ Max Unit
OPERATING CONDITIONS RF Frequency Range 81 86 GHz PERFORMANCE Gain 19 22 dB Gain Variation over Temperature 0.03 dB/°C Gain Control Range 12 17 dB Output Power for 1 dB Compression (P1dB) 16 20 dBm Saturated Output Power (PSAT) 21 dBm Output Third-Order Intercept (OIP3) at Maximum Gain1 27.5 dBm Input Return Loss 12 dB Output Return Loss 10 dB POWER SUPPLY Total Supply Current (IDD)2 265 mA 1 Data taken at power input (PIN) = −10 dBm/tone, 1 MHz spacing. 2 Set VCTL1/VCTL2 = −5 V and then adjust VGG1/VGG2, VGG3, VGG4, VGG5, and VGG6 from −2 V to 0 V to achieve a total drain current (IDD) = 265 mA. Rev. B | Page 3 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE