Datasheet BM83 (Microchip) - 9
| Manufacturer | Microchip |
| Description | BM83 Bluetooth Stereo Audio Module |
| Pages / Page | 76 / 9 — BM83. Device Overview. Note: . Figure 2-1. BM83 Module Application Modes. … |
| File Format / Size | PDF / 4.9 Mb |
| Document Language | English |
BM83. Device Overview. Note: . Figure 2-1. BM83 Module Application Modes. Embedded Mode. Host Mode. Datasheet
Model Line for this Datasheet
Text Version of Document
BM83 Device Overview 2. Device Overview
The BM83 stereo audio module is built around the IS2083BM SoC, which integrates the dual-mode baseband, modem, radio transceiver, PMU, MCU, crystal, and a DSP dedicated for audio and voice applications. Users can configure the BM83 module by using the SDK or the IS208x_Config_GUI_Tool (Config Tool). There are two modes of operation: • Host mode: – Interfaces with an external MCU over UART for application specific system control. – The multi-speaker (MSPK) solution can reside on this MCU. • Embedded mode: – No external MCU involved. – BM83 acts as an MCU to control all peripherals to provide various speaker features. – Integrates the MSPK firmware on the module. – Simple system control can be implemented in the module MCU by using the SDK. – DSP parameters such as equalizer settings can be set using the Config Tool.
Note:
The SDK and Config Tool are available for download at: http://www.microchip.com/BM83. The following figure illustrates the Embedded mode and Host mode of the BM83 module.
Figure 2-1. BM83 Module Application Modes Embedded Mode Host Mode
UART Host Smartphone Smartphone MCU I2C
BM83
External
BM83
C2I I/O I2S DSP/Audio MCLK Microphone Amplifier Microphone External MCLK I2S DSP/Audio Amplifier Line-In Line-In Battery DC Adapter Battery DC Adapter © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 9 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
The BM83 stereo audio module is built around the IS2083BM SoC, which integrates the dual-mode baseband, modem, radio transceiver, PMU, MCU, crystal, and a DSP dedicated for audio and voice applications. Users can configure the BM83 module by using the SDK or the IS208x_Config_GUI_Tool (Config Tool). There are two modes of operation: • Host mode: – Interfaces with an external MCU over UART for application specific system control. – The multi-speaker (MSPK) solution can reside on this MCU. • Embedded mode: – No external MCU involved. – BM83 acts as an MCU to control all peripherals to provide various speaker features. – Integrates the MSPK firmware on the module. – Simple system control can be implemented in the module MCU by using the SDK. – DSP parameters such as equalizer settings can be set using the Config Tool.
Note:
The SDK and Config Tool are available for download at: http://www.microchip.com/BM83. The following figure illustrates the Embedded mode and Host mode of the BM83 module.
Figure 2-1. BM83 Module Application Modes Embedded Mode Host Mode
UART Host Smartphone Smartphone MCU I2C
BM83
External
BM83
C2I I/O I2S DSP/Audio MCLK Microphone Amplifier Microphone External MCLK I2S DSP/Audio Amplifier Line-In Line-In Battery DC Adapter Battery DC Adapter © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 9 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
