Datasheet MIC920 (Microchip) - 7

ManufacturerMicrochip
Description80 MHz Low-Power SC70 Op Amp
Pages / Page24 / 7 — MIC920. FIGURE 2-7:. FIGURE 2-10:. FIGURE 2-8:. FIGURE 2-11:. FIGURE …
File Format / SizePDF / 3.3 Mb
Document LanguageEnglish

MIC920. FIGURE 2-7:. FIGURE 2-10:. FIGURE 2-8:. FIGURE 2-11:. FIGURE 2-9:. FIGURE 2-12:

MIC920 FIGURE 2-7: FIGURE 2-10: FIGURE 2-8: FIGURE 2-11: FIGURE 2-9: FIGURE 2-12:

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MIC920
) 84 0.5 A 85qC m 80 0 Vr = r5V ( ) T 76 V -0.5 N –40qC ( E 72 E -1.0 R G R 68 25qC A -1.5 U T C 64 L -2.0 25qC O T 85qC I 60 V -2.5 U T –40qC C -3.0 56 U RI P -3.5 52 T C- U T -4.0 48 O R -4.5 O 44 H -5.0 S 40 0. 5. 0. 5. 0. 5. 0. 5. 0. 5. 0 2.0 3.4 4.8 6.2 7.6 9.0 5 0 6 1 7 2 8 3 9 4 4 4 3 3 2 2 1 1 SUPPLY VOLTAGE (V) OUTPUT CURRENT (mA)
FIGURE 2-7:
Short Circuit Current vs.
FIGURE 2-10:
Output Voltage vs. Output Supply Voltage (Sourcing). Current (Sinking). ) 17 11 A Vr = r9V m 20 ( 10 ) T 23 V 9 N ( E 26 E 8 R G R 29 A 7 U T 25qC C 32 L 6 –40qC T O I 35 V 5 U T C 38 25qC 4 U RI O 41 85qC 3 C T - T U 44 2 R O 85qC O 47 –40 1 H qC S 50 0 2.0 3.4 4.8 6.2 7.6 9.0 0 8- 6 4 2 0 8 6 4 2 0 1- 2- 3- 4- 4- 5- 6- 7- 8- SUPPLY VOLTAGE (V) OUTPUT CURRENT (mA)
FIGURE 2-8:
Short Circuit Current vs.
FIGURE 2-11:
Output Voltage vs. Output Supply Voltage (Sinking). Current (Sourcing). 5.5 1 5.0 Vr = r5V 25qC Vr = r9V ) 0 V 4.5 ( ) V -1 E 4.0 85qC ( G E -2 85qC A 3.5 G T A -3 L 3.0 T O 25qC L -4 V 2.5 –40qC O T V -5 2.0 U T P -6 U –40qC T 1.5 O U -7 T 1.0 O U -8 0.5 O -9 0 0 8- 6 4 2 0 8 6 4 2 0 -10 1- 2- 3- 4- 4- 5- 6- 7- 8- 0 5 0 5 0 5 0 5 0 5 0 5 4 4 3 3 2 2 1 1 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA)
FIGURE 2-9:
Output Voltage vs. Output
FIGURE 2-12:
Output Voltage vs. Output Current (Sourcing). Current (Sinking).  2019 Microchip Technology Inc. DS20006268A-page 7 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service