Datasheet TCA0372, TCA0372B, NCV0372B (ON Semiconductor) - 8

TCA0372, TCA0372B, NCV0372B PACKAGE DIMENSIONS PDIP−8 DP1 SUFFIX
CASE 626−05 ISSUE M NOTES:
D A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
D1
2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION E IS MEASURED WITH THE LEADS RE-
E
STRAINED PARALLEL AT WIDTH E2. 4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH.
8 5
5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS E1 DIM MIN NOM MAX MIN NOM MAX A
−−−− −−−− 0.210 −−−− −−−− 5.33
1 4 A1
0.015 −−−− −−−− 0.38 −−−− −−−−
b
0.014 0.018 0.022 0.35 0.46 0.56
C
0.008 0.010 0.014 0.20 0.25 0.36
NOTE 5 F D
0.355 0.365 0.400 9.02 9.27 10.02
c D1
0.005 −−−− −−−− 0.13 −−−− −−−−
TOP VIEW E
0.300 0.310 0.325 7.62 7.87 8.26
E2 E1
0.240 0.250 0.280 6.10 6.35 7.11
END VIEW E2
0.300 BSC 7.62 BSC
NOTE 3 E3
−−−− −−−− 0.430 −−−− −−−− 10.92
e
0.100 BSC 2.54 BSC
e/2 A L
0.115 0.130 0.150 2.92 3.30 3.81
L A1 C SEATING PLANE e E3 8X b
0.010 M C A
SIDE VIEW END VIEW PDIP−16 DP2 SUFFIX
CASE 648−08 ISSUE T NOTES:
−A−
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
16 9
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
B
4. DIMENSION B DOES NOT INCLUDE
1 8
MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
F C L INCHES MILLIMETERS DIM MIN MAX MIN MAX S A
0.740 0.770 18.80 19.55
B
0.250 0.270 6.35 6.85
C
0.145 0.175 3.69 4.44
SEATING −T− PLANE D
0.015 0.021 0.39 0.53
F
0.040 0.70 1.02 1.77
G
0.100 BSC 2.54 BSC
H K J M H
0.050 BSC 1.27 BSC
G J
0.008 0.015 0.21 0.38
D 16 PL K
0.110 0.130 2.80 3.30
L
0.295 0.305 7.50 7.74 0.25 (0.010) M T A M
M
0 _ 10 _ 0 _ 10 _
S
0.020 0.040 0.51 1.01
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