Datasheet MAX22700D, MAX22700E, MAX22701D, MAX22701E, MAX22702D, MAX22702E (Maxim) - 2
| Manufacturer | Maxim |
| Description | Ultra-High CMTI Isolated Gate Drivers |
| Pages / Page | 30 / 2 — Absolute Maximum Ratings. Package Information. PACKAGE TYPE: 8 NARROW … |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
Absolute Maximum Ratings. Package Information. PACKAGE TYPE: 8 NARROW SOIC. 21-0041. 90-0096
Model Line for this Datasheet
Text Version of Document
MAX22700D–MAX22702D Ultra-High CMTI MAX22700E–MAX22702E Isolated Gate Drivers
Absolute Maximum Ratings
VDDA to GNDA ..-0.3V to +6V OUT to VSSB ..-0.3V to (VDDB + 0.3V) VDDB to GNDB ..-0.3V to +40V Continuous Power Dissipation (TA = +70°C) GNDB to VSSB ..-0.3V to +40V Narrow SOIC (derate 9.39mW/°C above +70°C) ..750.89mW VDDB to VSSB ...-0.3V to +40V Operating Temperature Range ... -40°C to +125°C INP, INN, IN, EN to GNDA...-0.3V to +6V Maximum Junction Temperature ...+150°C VDDB to ADJ ..-0.3V to +6V Storage Temperature Range .. -60°C to +150°C CLAMP to VSSB ...-0.3V to (VDDB + 0.3V) Soldering Temperature (reflow) ...+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information PACKAGE TYPE: 8 NARROW SOIC
Package Code S8MS+23 Outline Number
21-0041
Land Pattern Number
90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 106.54°C/W Junction to Case (θJC) 44.91°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
DC Electrical Characteristics
(VDDA - VGNDA = 5V, VDDB - VSSB = 20V, VGNDA = VSSB = 0V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY
VDDA Relative to GNDA 3 5.5 Relative to GNDB, MAX22700 13 36 Supply Voltage VDDB Relative to VSSB, MAX22701 13 36 V Relative to VSSB, MAX22702 6 36 VSSB Relative to GNDB, MAX22700 -16 0 Differential Supply VDIFF VDDB - VSSB, MAX22700 13 36 Undervoltage-Lockout VUVLOAP VDDA rising 2.69 2.82 2.95 V Threshold VUVLOAN VDDA falling 2.59 2.72 2.85 V Undervoltage-Lockout Threshold Hysteresis VUVLOA_HYST 100 mV www.maximintegrated.com Maxim Integrated │ 2
Absolute Maximum Ratings
VDDA to GNDA ..-0.3V to +6V OUT to VSSB ..-0.3V to (VDDB + 0.3V) VDDB to GNDB ..-0.3V to +40V Continuous Power Dissipation (TA = +70°C) GNDB to VSSB ..-0.3V to +40V Narrow SOIC (derate 9.39mW/°C above +70°C) ..750.89mW VDDB to VSSB ...-0.3V to +40V Operating Temperature Range ... -40°C to +125°C INP, INN, IN, EN to GNDA...-0.3V to +6V Maximum Junction Temperature ...+150°C VDDB to ADJ ..-0.3V to +6V Storage Temperature Range .. -60°C to +150°C CLAMP to VSSB ...-0.3V to (VDDB + 0.3V) Soldering Temperature (reflow) ...+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information PACKAGE TYPE: 8 NARROW SOIC
Package Code S8MS+23 Outline Number
21-0041
Land Pattern Number
90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 106.54°C/W Junction to Case (θJC) 44.91°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
DC Electrical Characteristics
(VDDA - VGNDA = 5V, VDDB - VSSB = 20V, VGNDA = VSSB = 0V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY
VDDA Relative to GNDA 3 5.5 Relative to GNDB, MAX22700 13 36 Supply Voltage VDDB Relative to VSSB, MAX22701 13 36 V Relative to VSSB, MAX22702 6 36 VSSB Relative to GNDB, MAX22700 -16 0 Differential Supply VDIFF VDDB - VSSB, MAX22700 13 36 Undervoltage-Lockout VUVLOAP VDDA rising 2.69 2.82 2.95 V Threshold VUVLOAN VDDA falling 2.59 2.72 2.85 V Undervoltage-Lockout Threshold Hysteresis VUVLOA_HYST 100 mV www.maximintegrated.com Maxim Integrated │ 2
