Datasheet STPMIC1 (STMicroelectronics) - 10

ManufacturerSTMicroelectronics
DescriptionHighly integrated power management IC for micro processor units
Pages / Page141 / 10 — STPMIC1. Electrical and timing parameters. Symbol. Parameter. Test …
File Format / SizePDF / 8.7 Mb
Document LanguageEnglish

STPMIC1. Electrical and timing parameters. Symbol. Parameter. Test conditions. Min. Typ. Max. Unit. LDO1, LDO2, LDO5

STPMIC1 Electrical and timing parameters Symbol Parameter Test conditions Min Typ Max Unit LDO1, LDO2, LDO5

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STPMIC1 Electrical and timing parameters Symbol Parameter Test conditions Min. Typ. Max. Unit
t BOOST OCP turn- OCPDB_BST 2 µs off delay t Switches OCP turn- OCPDB_SW 30 ms off delay Programmable value, defined in register 1 to 256 t Table 34. WDG_CR WD Watchdog timer s Timer programming step 1 NVM NVM write cycles END 1000 Cycle endurance
LDO1, LDO2, LDO5 VLDOIN = 3.6 V, VIN = 3.6 V, VBUCK2IN = 3.6 V, VLDOOUT = 1.8 V, recommended BOM, Tj = -40 °C to +125 °C, unless otherwise specified,VBUCK1IN and VBUCK2IN must always be connected to VIN
V Main input voltage LDOIN 2.8 5.5 V range VLDOIN >VLDOOUT+VLDODROP LDO1 LDO2 1.7 to 3.3 V Programmable value. Refer to V Table 9. LDO output voltage LDOOUT Output voltage LDO5 1.7 to 3.9 V settings Voltage programming step 100 mV V V Output voltage LDOIN >VLDOOUT+VLDODROP 1 LDOOUT-ACC -2 2 % accuracy mA<ILDOOUT<350 mA I Continuous output LDOOUT V current LDOIN = 2.8 V to 5.5 V 350 mA I Load current LDOLIM V limitation LDOIN = 2.8 V to 5.5 V 360 450 800 mA I I Total quiescent LDOOUT = 0 mA, TJ = +105 °C total current from LDOQ 4 20 µA current all LDO supply pins (VIN, LDOIN, BUCK2IN) I Input leakage LDOIN_LKG LDO OFF 0.5 2.5 µA current VLDODROP Dropout voltage (1) VLDOOUT = 2.8 V, ILDOOUT = 350 mA 180 300 mV I V Load transient LDOOUT = 5 to 180 mA, ΔVLDOIN = 0, tR = tF ~1 LDOOUT-LO 45 mV regulation µs V V Line transient LDOIN = 3.6 V to 3.0 V, ΔILDO1OUT = 0, tR = tF LDOOUT-LI 10 mV regulation ~10 μs ΔVLDOIN = 300 mVPP, f=[0.1:20] kHz 43 PSRR Power supply LDO dB rejection ratio ΔVLDOIN = 300 mVPP, f=[20:100] kHz 37 2.8 V<V t LDOIN<5.5 V, 0<ILDOOUT<1 mA SSLDO Soft-start duration 160 µs COUT=4.7 µF Pull-down enabled, V t LDOOUT=1.8 V to SDLDO Shutdown duration 3 ms VLDOOUT=0.2 V, ILDOOUT= no load
LDO3 normal mode VLDO3IN = 3.6 V, VIN = 3.6 V, VBUCK2IN = 3.6 V, VLDO3OUT = 1.8 V, recommended BOM, Tj = -40 °C to +12 5 °C, unless otherwise specified
V Main input voltage LDO3IN 2.8 5.5 V range
DS12792
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Rev 2 page 10/141
Document Outline Features Applications Description 1 Device configuration table 2 Typical application schematic 2.1 Recommended external components 2.2 Pinout and pin description 3 Electrical and timing characteristics 3.1 Absolute maximum ratings 3.2 Thermal characteristics 3.3 Consumption in typical application scenarios 3.4 Electrical and timing parameters 3.5 Application board curves 4 Power regulators and switch description 4.1 Overview 4.2 LDO regulators 4.2.1 LDO regulators - common features 4.2.2 LDO regulators - special features 4.2.3 LDO output voltage settings 4.3 DDR memory sub-system examples 4.3.1 Powering lpDDR2/lpDDR3 memory 4.3.2 Powering DDR3/DDR3L memory 4.4 Buck converters 4.4.1 BUCK general description 4.4.2 BUCK output voltage settings 4.5 Boost converter and power switches 4.5.1 Boost converter 4.5.2 PWR_USB_SW and PWR_SW power switches 4.6 USB sub-system examples 5 Functional description 5.1 Overview 5.2 Functional state machine 5.2.1 Main state machine diagram 5.2.2 State explanations 5.3 POWER_UP, POWER_DOWN sequence 5.4 Feature description 5.4.1 VIN conditions and monitoring 5.4.2 Turn-ON conditions 5.4.3 Turn-OFF conditions and restart_request 5.4.4 Reset and mask_reset option 5.4.5 Power control modes (MAIN / ALTERNATE) 5.4.6 Thermal protection 5.4.7 Overcurrent protection (OCP) 5.4.8 BOOST overvoltage protection 5.4.9 Watchdog feature 5.5 Programming 5.5.1 I2C interface 5.5.2 Non-volatile memory (NVM) 6 Register description 6.1 User register map 6.2 Status registers 6.2.1 Turn-ON status register (TURN_ON_SR) 6.2.2 Turn-OFF status register (TURN_OFF_SR) 6.2.3 Overcurrent protection LDO turn-OFF status register (OCP_LDOS_SR) 6.2.4 Overcurrent protection buck turn-OFF status register (OCP_BUCKS_BSW_SR) 6.2.5 Restart status register (RESTART_SR) 6.2.6 Version status register (VERSION_SR) 6.3 Control registers 6.3.1 Main control register (MAIN_CR) 6.3.2 Pads pull control register (PADS_PULL_CR) 6.3.3 Bucks pull-down control register (BUCKS_PD_CR) 6.3.4 LDO1-4 pull-down control register (LDO14_PD_CR) 6.3.5 LDO5/6 pull-down control register (LDO56_VREF_PD_CR) 6.3.6 PWR_SWOUT and VIN control register (SW_VIN_CR) 6.3.7 PONKEYn turn-OFF control register (PKEY_TURNOFF_CR) 6.3.8 Mask reset Buck control register (BUCKS_MRST_CR) 6.3.9 Mask reset LDO control register (LDOS_MRST_CR) 6.3.10 Watchdog control register (WDG_CR) 6.3.11 Watchdog timer control register (WDG_TMR_CR) 6.3.12 Bucks OCP turn-OFF control register (BUCKS_OCPOFF_CR) 6.3.13 LDO OCP turn-OFF control register (LDOS_OCPOFF_CR) 6.4 Power supplies control registers 6.4.1 BUCKx MAIN mode control registers (BUCKx_MAIN_CR) (x=1…4) 6.4.2 REFDDR MAIN mode control register (REFDDR_MAIN_CR) 6.4.3 LDOx MAIN mode control registers (LDOx_MAIN_CR) (x=1, 2, 5, 6) 6.4.4 LDO3 MAIN mode control register (LDO3_MAIN_CR) 6.4.5 LDO4 MAIN mode control register (LDO4_MAIN_CR) 6.4.6 BUCKx ALTERNATE mode control registers (BUCKx_ALT_CR)(x=1..4) 6.4.7 REFDDR ALTERNATE mode control register (REFDDR_ALT_CR) 6.4.8 LDOx ALTERNATE mode control registers (LDOx_ALT_CR) (x=1, 2, 5, 6) 6.4.9 LDO3 ALTERNATE mode control register (LDO3_ALT_CR) 6.4.10 LDO4 ALTERNATE mode control register (LDO4_ALT_CR) 6.4.11 Boost/switch control register (BST_SW_CR) 6.5 Interrupt registers 6.5.1 Overall interrupt register behavior 6.5.2 Interrupt pending register 1 (INT_PENDING_R1) 6.5.3 Interrupt pending register 2 (INT_PENDING_R2) 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) 6.5.6 Interrupt debug latch registers (INT_DBG_LATCH_Rx) 6.5.7 Interrupt clear registers (INT_CLEAR_Rx) 6.5.8 Interrupt mask registers (INT_MASK_Rx) 6.5.9 Interrupt set mask registers (INT_SET_MASK_Rx) 6.5.10 Interrupt clear mask registers (INT_CLEAR_MASK_Rx) 6.5.11 Interrupt source register 1 (INT_SRC_R1) 6.5.12 Interrupt source register 2 (INT_SRC_R2) 6.5.13 Interrupt source register 3 ( INT_SRC_R3) 6.5.14 Interrupt source register 4 ( INT_SRC_R4) 6.6 NVM registers 6.6.1 NVM status register (NVM_SR) 6.6.2 NVM control register (NVM_CR) 6.7 NVM shadow registers 6.7.1 NVM main control shadow register (NVM_MAIN_CTRL_SHR) 6.7.2 NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR) 6.7.3 NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1) 6.7.4 NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2) 6.7.5 NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR) 6.7.6 NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1 6.7.7 NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2) 6.7.8 NVM device address shadow register (I2C_ADDR_SHR) 7 Package information 7.1 WFQFN 44L (5X6X0.8) package information 8 Marking composition 9 Ordering information Revision history