Datasheet VOMA618A (Vishay) - 9
| Manufacturer | Vishay |
| Description | Optocoupler, Phototransistor Output, Low Input Current, SOP-4, Mini-Flat Package |
| Pages / Page | 10 / 9 — VOMA618A. SOLDER PROFILES. HANDLING AND STORAGE CONDITIONS. DRYPACK. … |
| File Format / Size | PDF / 236 Kb |
| Document Language | English |
VOMA618A. SOLDER PROFILES. HANDLING AND STORAGE CONDITIONS. DRYPACK. FLOOR LIFE. DRYING
Model Line for this Datasheet
Text Version of Document
VOMA618A
www.vishay.com Vishay Semiconductors
SOLDER PROFILES HANDLING AND STORAGE CONDITIONS
Axis Title ESD level: HBM class 2 300 10000 Max. 260 °C
DRYPACK
255 °C 250 245 °C 240 °C Devices are packed in moisture barrier bags (MBB) to 217 °C prevent the products from moisture absorption during 200 1000 transportation and storage. Each bag contains a desiccant. Max. 30 s ine ne ne 150
FLOOR LIFE
1st li 2nd l 2nd li Max. 120 s Max. 100 s Floor life (time between soldering and removing from MBB) 100 100 Temperature (°C) Max. ramp down 6 °C/s must not exceed the time indicated on MBB label: 50 Max. ramp up 3 °C/s Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % 0 10 Moisture sensitivity level 3, according to J-STD-020. 0 50 100 150 200 250 300 19841 Time (s)
DRYING
Fig. 22 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 for SMD Devices In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-033D. Rev. 1.1, 05-Jul-2019
9
Document Number: 84949 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
SOLDER PROFILES HANDLING AND STORAGE CONDITIONS
Axis Title ESD level: HBM class 2 300 10000 Max. 260 °C
DRYPACK
255 °C 250 245 °C 240 °C Devices are packed in moisture barrier bags (MBB) to 217 °C prevent the products from moisture absorption during 200 1000 transportation and storage. Each bag contains a desiccant. Max. 30 s ine ne ne 150
FLOOR LIFE
1st li 2nd l 2nd li Max. 120 s Max. 100 s Floor life (time between soldering and removing from MBB) 100 100 Temperature (°C) Max. ramp down 6 °C/s must not exceed the time indicated on MBB label: 50 Max. ramp up 3 °C/s Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % 0 10 Moisture sensitivity level 3, according to J-STD-020. 0 50 100 150 200 250 300 19841 Time (s)
DRYING
Fig. 22 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 for SMD Devices In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-033D. Rev. 1.1, 05-Jul-2019
9
Document Number: 84949 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
