Datasheet LTM8024 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 40VIN, Dual 3.5A or Single 7A Silent Switcher μModule Regulator |
| Pages / Page | 24 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revision | A |
| File Format / Size | PDF / 2.8 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTM8024
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN, RUN, PG ..42V VOUT, BIAS ...10V 8 FB ..4V BANK 4 BANK 5 7 TRSS ...3V VOUT1 VOUT2 SYNC ...6V 6 BANK 3 GND Maximum Internal Temperature (Note 2) .. 125°C 5 Storage Temperature ... –55°C to 125°C BIAS AUX1 CLKOUT SYNC 4 Peak Reflow Solder Body Temperature .. 250°C FB1 AUX2 SHARE1 PG2 PG1 3 FB2 TRSS2 SHARE2 RUN2 TEST 2 GND TRSS1 RT RUN1 GND 1 BANK 1 VIN1 BANK 1 VIN2 A B C D E F G H J K L BGA PACKAGE 88-PIN (11.25mm × 9mm × 3.32mm) TJMAX = 125°C, θJA = 18.0°C/W, θJCtop = 10.0°C/W, θJB = 4.5°C/W, WEIGHT = 1.0g θ VALUES DETERMINED PER JESD 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING RANGE (SEE NOTE 2)
LTM8024EY#PBF SAC305 (RoHS) LTM8024Y e1 BGA 3 –40°C to 125°C LTM8024IY#PBF • Contact the factory for parts specified with wider operating temperature ranges. • This product is not recommended for second side reflow. • Device temperature grade is indicated by a label on the shipping container. *Pad This product is moisture sensitive. For more information, go to: or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package PHOTOGRAPH Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN, RUN, PG ..42V VOUT, BIAS ...10V 8 FB ..4V BANK 4 BANK 5 7 TRSS ...3V VOUT1 VOUT2 SYNC ...6V 6 BANK 3 GND Maximum Internal Temperature (Note 2) .. 125°C 5 Storage Temperature ... –55°C to 125°C BIAS AUX1 CLKOUT SYNC 4 Peak Reflow Solder Body Temperature .. 250°C FB1 AUX2 SHARE1 PG2 PG1 3 FB2 TRSS2 SHARE2 RUN2 TEST 2 GND TRSS1 RT RUN1 GND 1 BANK 1 VIN1 BANK 1 VIN2 A B C D E F G H J K L BGA PACKAGE 88-PIN (11.25mm × 9mm × 3.32mm) TJMAX = 125°C, θJA = 18.0°C/W, θJCtop = 10.0°C/W, θJB = 4.5°C/W, WEIGHT = 1.0g θ VALUES DETERMINED PER JESD 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING RANGE (SEE NOTE 2)
LTM8024EY#PBF SAC305 (RoHS) LTM8024Y e1 BGA 3 –40°C to 125°C LTM8024IY#PBF • Contact the factory for parts specified with wider operating temperature ranges. • This product is not recommended for second side reflow. • Device temperature grade is indicated by a label on the shipping container. *Pad This product is moisture sensitive. For more information, go to: or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package PHOTOGRAPH Revision History Typical Application Related Parts
