Datasheet LTM8063 (Analog Devices) - 3
| Manufacturer | Analog Devices |
| Description | 40VIN, 2A Silent Switcher µModule Regulator |
| Pages / Page | 24 / 3 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER … |
| Revision | C |
| File Format / Size | PDF / 2.6 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. PART NUMBER. TERMINAL FINISH
Model Line for this Datasheet
Text Version of Document
LTM8063
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
V TOP VIEW IN, RUN, PG Voltage ..42V GND VOUT Voltage ...19V FB TR/SS GND FB, TR/SS Voltage...4V A SYNC Voltage ..6V PG SYNC RUN B FB Maximum Internal Temperature .. 125°C RT BANK 2 Storage Temperature.. –55°C to 125°C C VIN Peak Reflow Solder Body Temperature ...260°C BANK 1 D GND E F BANK 3 VOUT G 1 2 3 4 BGA PACKAGE 28-LEAD (6.25mm × 4mm × 2.22mm) BGA PACKAGE TJMAX = 125°C, θJA = 41.5°C/W, θJCbottom = 13°C/W θJCtop = 52.4°C/W, θJB = 16.3°C/W, WEIGHT = 0.14g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8063EY#PBF SAC305 (RoHS) v LTM8063IY#PBF 8063 BGA 3 –40°C to 125°C LTM8063IY SnPb (63/37) • • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev C For more information www.analog.com 3 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photo Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
V TOP VIEW IN, RUN, PG Voltage ..42V GND VOUT Voltage ...19V FB TR/SS GND FB, TR/SS Voltage...4V A SYNC Voltage ..6V PG SYNC RUN B FB Maximum Internal Temperature .. 125°C RT BANK 2 Storage Temperature.. –55°C to 125°C C VIN Peak Reflow Solder Body Temperature ...260°C BANK 1 D GND E F BANK 3 VOUT G 1 2 3 4 BGA PACKAGE 28-LEAD (6.25mm × 4mm × 2.22mm) BGA PACKAGE TJMAX = 125°C, θJA = 41.5°C/W, θJCbottom = 13°C/W θJCtop = 52.4°C/W, θJB = 16.3°C/W, WEIGHT = 0.14g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8063EY#PBF SAC305 (RoHS) v LTM8063IY#PBF 8063 BGA 3 –40°C to 125°C LTM8063IY SnPb (63/37) • • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev C For more information www.analog.com 3 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photo Package Description Revision History Typical Application Related Parts
