Datasheet ADA4177-1, ADA4177-2, ADA4177-4 (Analog Devices) - 8

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ADA4177-1/ADA4177-2/ADA4177-4 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 4.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated by the output stage transistor. It is calculated as follows: Supply Voltage 36 V Input Voltage VSY ± 32 V PD = (VSY × ISY) + (VSY − VOUT) × ILOAD Differential Input Voltage ±VSY where: Output Short-Circuit Duration to GND See the Maximum Power VSY is the power supply rail. Dissipation section ISY is the quiescent current. Storage Temperature Range −65°C to +150°C VOUT is the output of the amplifier. Operating Temperature Range −40°C to +125°C ILOAD is the output load. Junction Temperature Range −65°C to +150°C Lead Temperature, Soldering (10 sec)1 300°C Do not exceed the 150°C maximum junction temperature for Electrostatic Discharge (ESD) the device. Exceeding the junction temperature limit can cause Human Body Model (HBM)2 4 kV degradation in the parametric performance or even destroy the Field Induced Charged Device 1250 V device. Refer to Technical Article MS-2251, Data Sheet Intricacies— Model (FICDM)3 Absolute Maximum Ratings and Thermal Resistances, for more Machine Model (MM) 200 V information.
THERMAL RESISTANCE
1 IPC/JEDEC J-STS-020D applicable standard. 2 ESDA/JEDEC JS-001-2011 applicable standard. Thermal resistance between junction and ambient (θ 3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard. JA) is specified for the worst case conditions, that is, a device soldered Stresses at or above those listed under Absolute Maximum in a circuit board for surface-mount packages. Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
Table 5. Thermal Resistance
or any other conditions above those indicated in the operational
Package Type θJA θJC Unit
section of this specification is not implied. Operation beyond 8-Lead MSOP 190 44 °C/W the maximum operating conditions for extended periods may 8-Lead SOIC 158 43 °C/W affect product reliability. 14-Lead TSSOP 240 43 °C/W
MAXIMUM POWER DISSIPATION
14-Lead SOIC 115 36 °C/W The ADA4177-1/ADA4177-2/ADA4177-4 can drive a short- circuit output current of up to 65 mA. However, the usable
ESD CAUTION
output load current drive is limited by the maximum power dissipation allowed by the device package. The absolute maximum junction temperature is 150°C (see Table 4). The junction temperature can be estimated as follows: T J = PD × θJA + TA where: T J is the die junction temperature. PD is the power dissipated in the package. θJA is the thermal resistance of the package. TA is the ambient temperature. Rev. E | Page 8 of 33 Document Outline Features Applications General Description Pin Connection Diagram Revision History Specifications Electrical Characteristics, ±5 V Electrical Characteristics, ±15 V Absolute Maximum Ratings Maximum Power Dissipation Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Active Overvoltage Protection Common Protection Methods Add an External Series Input Resistor Add External Clamping Diodes Input Protection Circuit Limiting Overvoltage Current Out of the Positive Supply Pin EMI Protection Self Heating Using the ADA4177-1/ADA4177-2/ADA4177-4 as a Comparator Output Phase Reversal Proper Printed Circuit Board (PCB) Layout Long-Term Drift Temperature Hysteresis Outline Dimensions Ordering Guide