Datasheet ZSSC3240 (Renesas) - 6
| Manufacturer | Renesas |
| Description | Sensor Signal Conditioner IC for Resistive Sensors |
| Pages / Page | 64 / 6 — ZSSC3240. 1. Pin Assignments. ZSSC324x. Figure 1. Pin Assignments for 4. … |
| Revision | 20200414 |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
ZSSC3240. 1. Pin Assignments. ZSSC324x. Figure 1. Pin Assignments for 4. 4 mm2 24-QFN Package – Top View. Figure 2
Model Line for this Datasheet
Text Version of Document
ZSSC3240 1. Pin Assignments
The ZSSC324x is available as 8-inch wafers and in a 24-QFN package. Detailed information about die and wafers is available on request (see last page for contact information). rl ct . O . t . D .c D .c ex .c n L n T n VD 25 24 23 22 21 20 19 1 18 VDDB VSS INP 2 17 FB VSSB 3 16 AOUT / OWI1
ZSSC324x
INN 4 15 OWI2in IDT-Test 5 14 EOC 6 IDT-Test 13 SS 7 8 9 10 11 12 t . s A L e .c n SO ESQ -T SD SC / MI R T / ID SI K L MO SC : QFN-bottom plate, Exposed PAD.
Figure 1. Pin Assignments for 4
×
4 mm2 24-QFN Package – Top View
IC Core Seal Ring LDOctrl VDD Text VSS VDDB FB INP VSSB AOUT / OWI1 INN OWI2in EOC IDT-Test SS IDT-Test MISO RESQ MOSI / SDA IDT-Test SCLK / SCL
Figure 2. Pin (Pad) Assignments for Bare Die
Apr.15.20 Page 6 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Recommended Operating Conditions 5. Electrical Characteristics 6. Device Description 6.1 Signal Flow 6.2 Analog (Sensor) Front-End 6.2.1. Programmable-Gain Amplifier (PGA) 6.2.2. Analog-to-Digital Converter (ADC) 6.2.3. Internal Temperature Sensor 6.2.4. Supported Supplies for Sensor Elements and Additional, External Temperature Sensing 6.3 On-Chip Diagnostics 6.4 Digital Interfaces 6.4.1. SPI 6.4.2. I2C 6.4.3. One-Wire-Interface, OWI 6.5 Measurement and Output Options 6.5.1. Single Measurements, Digital Raw Results, and SSC Results 6.5.2. Cyclic, Continuous, Repeated Measurements – Measurement Scheduler 6.5.3. Analog Outputs: Digital-to-Analog Converter (DAC) 6.5.4. Output Interrupt Signaling 6.6 System Setup and Control 6.6.1. Digital Commands 6.6.2. Nonvolatile Memory (NVM) 6.6.3. Digital Sensor-Signal-Conditioning Mathematics 6.7 External, Extra LDO (LDOctrl) for Applications for > 5.5V 7. Calibration 8. Package Outline Drawings 9. Marking Diagram 10. Ordering Information 11. Glossary 12. Revision History
The ZSSC324x is available as 8-inch wafers and in a 24-QFN package. Detailed information about die and wafers is available on request (see last page for contact information). rl ct . O . t . D .c D .c ex .c n L n T n VD 25 24 23 22 21 20 19 1 18 VDDB VSS INP 2 17 FB VSSB 3 16 AOUT / OWI1
ZSSC324x
INN 4 15 OWI2in IDT-Test 5 14 EOC 6 IDT-Test 13 SS 7 8 9 10 11 12 t . s A L e .c n SO ESQ -T SD SC / MI R T / ID SI K L MO SC : QFN-bottom plate, Exposed PAD.
Figure 1. Pin Assignments for 4
×
4 mm2 24-QFN Package – Top View
IC Core Seal Ring LDOctrl VDD Text VSS VDDB FB INP VSSB AOUT / OWI1 INN OWI2in EOC IDT-Test SS IDT-Test MISO RESQ MOSI / SDA IDT-Test SCLK / SCL
Figure 2. Pin (Pad) Assignments for Bare Die
Apr.15.20 Page 6 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Recommended Operating Conditions 5. Electrical Characteristics 6. Device Description 6.1 Signal Flow 6.2 Analog (Sensor) Front-End 6.2.1. Programmable-Gain Amplifier (PGA) 6.2.2. Analog-to-Digital Converter (ADC) 6.2.3. Internal Temperature Sensor 6.2.4. Supported Supplies for Sensor Elements and Additional, External Temperature Sensing 6.3 On-Chip Diagnostics 6.4 Digital Interfaces 6.4.1. SPI 6.4.2. I2C 6.4.3. One-Wire-Interface, OWI 6.5 Measurement and Output Options 6.5.1. Single Measurements, Digital Raw Results, and SSC Results 6.5.2. Cyclic, Continuous, Repeated Measurements – Measurement Scheduler 6.5.3. Analog Outputs: Digital-to-Analog Converter (DAC) 6.5.4. Output Interrupt Signaling 6.6 System Setup and Control 6.6.1. Digital Commands 6.6.2. Nonvolatile Memory (NVM) 6.6.3. Digital Sensor-Signal-Conditioning Mathematics 6.7 External, Extra LDO (LDOctrl) for Applications for > 5.5V 7. Calibration 8. Package Outline Drawings 9. Marking Diagram 10. Ordering Information 11. Glossary 12. Revision History
