Datasheet ZSSC3240 (Renesas) - 7

ZSSC3240 2. Pin Descriptions Table 1. Pin Descriptions Pin Number Name Type Description
Analog Positive sensor (bridge) supply or sensor-signal input. 1 VDDB Input/Output 2 INP Analog Input Positive sensor (bridge) signal. 3 VSSB Analog Input Sensor (bridge) ground or sensor-signal input. 4 INN Analog Input Negative sensor (bridge) signal. 5 IDT-test – Renesas-internal use only. Connect to VSS or no connection; leave pin floating. 6 IDT-test – Renesas-internal use only. Connect to VSS or no connection; leave pin floating. 7 RESQ Digital Input Digital IC reset (low active); internal pull-up. 8 IDT-test – Renesas-internal use only. Connect to VSS or no connection; leave pin floating. Digital Digital data input for SPI or bidirectional data I/O for I2C. Pull-up to VDD. 9 MOSI / SDA Input/Output 10 n.c. – No connection. Leave pin floating. 11 SCLK / SCL Digital Input Clock input for SPI or I2C interface. Referenced to applied VDD level. Data output from ZSSC3240 to master for SPI interface. Referenced to applied 12 MISO Digital Output VDD level. 13 SS Digital Input Slave select (interface enable) for SPI. Referenced to applied VDD level. 14 EOC Digital Output End-of-conversion and output interrupt signal. 15 OWI2in Digital Input Optional OWI interface input line for current-loop applications. Analog Output; Analog smart-sensor output signal and/or OWI-interface input/output line. 16 AOUT / OWI1 Digital Input/Output Current-loop application feedback output (level below VSS!). No connection if not 17 FB Analog Output used. 18 VSS Ground Power supply ground. 19 VDD Supply Power supply. 20 n.c. – No connection. Leave pin floating. Current drive output for external temperature sensor and/or bridge in Current 21 TEXT Analog Output Mode. A 1500Ω serial resistor is built in the IC internally for pad-protection purposes. 22 n.c. – No connection. Leave pin floating. Control output (reference signal) for (optional) external regulator / supply control 23 LDOctrl Analog Output loop. 24 n.c. – No connection. Leave pin floating. QFN-bottom plate, i.e. Die-bottom/substrate. Leave pin floating (no electrical 25 Exposed PAD - connection), PAD to be used for heat dissipation only. Apr.15.20 Page 7 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Recommended Operating Conditions 5. Electrical Characteristics 6. Device Description 6.1 Signal Flow 6.2 Analog (Sensor) Front-End 6.2.1. Programmable-Gain Amplifier (PGA) 6.2.2. Analog-to-Digital Converter (ADC) 6.2.3. Internal Temperature Sensor 6.2.4. Supported Supplies for Sensor Elements and Additional, External Temperature Sensing 6.3 On-Chip Diagnostics 6.4 Digital Interfaces 6.4.1. SPI 6.4.2. I2C 6.4.3. One-Wire-Interface, OWI 6.5 Measurement and Output Options 6.5.1. Single Measurements, Digital Raw Results, and SSC Results 6.5.2. Cyclic, Continuous, Repeated Measurements – Measurement Scheduler 6.5.3. Analog Outputs: Digital-to-Analog Converter (DAC) 6.5.4. Output Interrupt Signaling 6.6 System Setup and Control 6.6.1. Digital Commands 6.6.2. Nonvolatile Memory (NVM) 6.6.3. Digital Sensor-Signal-Conditioning Mathematics 6.7 External, Extra LDO (LDOctrl) for Applications for > 5.5V 7. Calibration 8. Package Outline Drawings 9. Marking Diagram 10. Ordering Information 11. Glossary 12. Revision History