Datasheet BYD17 (NXP) - 7
| Manufacturer | NXP |
| Description | General purpose controlled avalanche rectifiers |
| Pages / Page | 8 / 7 — PACKAGE OUTLINE. Hermetically sealed glass surface mounted package; … |
| File Format / Size | PDF / 64 Kb |
| Document Language | English |
PACKAGE OUTLINE. Hermetically sealed glass surface mounted package; ImplotecTM(1) technology; 2 connectors. SOD87
Model Line for this Datasheet
Text Version of Document
Philips Semiconductors Product specification General purpose BYD17 series controlled avalanche rectifiers
PACKAGE OUTLINE Hermetically sealed glass surface mounted package; ImplotecTM(1) technology; 2 connectors SOD87 k
(2)
a
D D 1 L L H
DIMENSIONS (mm are the original dimensions) UNIT D D1 H L
0 1 2 mm 2.1 2.0 3.7 scale mm 0.3 2.0 1.8 3.3
Notes
1. Implotec is a trademark of Philips. 2. The marking indicates the cathode.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
99-03-31 SOD87 100H03 99-06-04
DEFINITIONS Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Nov 11 7
PACKAGE OUTLINE Hermetically sealed glass surface mounted package; ImplotecTM(1) technology; 2 connectors SOD87 k
(2)
a
D D 1 L L H
DIMENSIONS (mm are the original dimensions) UNIT D D1 H L
0 1 2 mm 2.1 2.0 3.7 scale mm 0.3 2.0 1.8 3.3
Notes
1. Implotec is a trademark of Philips. 2. The marking indicates the cathode.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
99-03-31 SOD87 100H03 99-06-04
DEFINITIONS Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Nov 11 7
