Datasheet ADCMP670 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Dual Low Power 1.5% Comparator With 400 mV Reference |
| Pages / Page | 16 / 6 — ADCMP670. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 5. … |
| Revision | A |
| File Format / Size | PDF / 337 Kb |
| Document Language | English |
ADCMP670. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 5. Parameter Range. Table 6. Thermal Resistance. Package Type. θJA Unit
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ADCMP670 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5.
θ
Parameter Range
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. VDD −0.3 V to +6 V +INA, −INB −0.3 V to +6 V
Table 6. Thermal Resistance
OUTA, OUTB −0.3 V to +6 V
Package Type θJA Unit
Output Short Circuit Duration1 Indefinite 6-Lead TSOT 200 °C/W Input Current −10 mA Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Lead Temperature Soldering (10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 When the output is shorted indefinitely, the use of a heat sink may be required to keep the junction temperature within the absolute maximum ratings. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 6 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATION INFORMATION COMPARATORS AND INTERNAL REFERENCE POWER SUPPLY INPUTS OUTPUTS ADDING HYSTERESIS OUTLINE DIMENSIONS ORDERING GUIDE
ADCMP670 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5.
θ
Parameter Range
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. VDD −0.3 V to +6 V +INA, −INB −0.3 V to +6 V
Table 6. Thermal Resistance
OUTA, OUTB −0.3 V to +6 V
Package Type θJA Unit
Output Short Circuit Duration1 Indefinite 6-Lead TSOT 200 °C/W Input Current −10 mA Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Lead Temperature Soldering (10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 When the output is shorted indefinitely, the use of a heat sink may be required to keep the junction temperature within the absolute maximum ratings. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 6 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATION INFORMATION COMPARATORS AND INTERNAL REFERENCE POWER SUPPLY INPUTS OUTPUTS ADDING HYSTERESIS OUTLINE DIMENSIONS ORDERING GUIDE
