Datasheet CMP401, CMP402 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | 23 ns and 65 ns Low Voltage Comparators |
| Pages / Page | 8 / 8 — Data Sheet. CMP401/CMP402. OUTLINE DIMENSIONS. 10.00 (0.3937). 9.80 … |
| Revision | B |
| File Format / Size | PDF / 173 Kb |
| Document Language | English |
Data Sheet. CMP401/CMP402. OUTLINE DIMENSIONS. 10.00 (0.3937). 9.80 (0.3858). 4.00 (0.1575). 6.20 (0.2441). 3.80 (0.1496)
Model Line for this Datasheet
Text Version of Document
Data Sheet CMP401/CMP402 OUTLINE DIMENSIONS 10.00 (0.3937) 9.80 (0.3858) 16 9 4.00 (0.1575) 6.20 (0.2441) 1 3.80 (0.1496) 8 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 45° 1.75 (0.0689) 0.25 (0.0098) 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) 1.27 (0.0500) PLANE 0.25 (0.0098) 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR 0606- REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 06
Figure 1. 16-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-16) S-Suffix Dimensions shown in millimeters and (inches)
5.10 5.00 4.90 16 9 4.50 6.40 4.40 BSC 4.30 1 8 PIN 1 1.20 MAX 0.15 0.20 0.05 0.09 0.75 8° 0.60 0.30 0.65 0° 0.19 SEATING 0.45 BSC PLANE COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 2. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
CMP401GRUZ-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 CMP401GSZ –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 CMP401GSZ-REEL –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 CMP402GRUZ-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 CMP402GSZ –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 CMP402GSZ-REEL –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 1 Z = RoHS Compliant Part.
©2002–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C00267-0-3/16(B)
Rev. B | Page 8 of 8
Figure 1. 16-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-16) S-Suffix Dimensions shown in millimeters and (inches)
5.10 5.00 4.90 16 9 4.50 6.40 4.40 BSC 4.30 1 8 PIN 1 1.20 MAX 0.15 0.20 0.05 0.09 0.75 8° 0.60 0.30 0.65 0° 0.19 SEATING 0.45 BSC PLANE COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 2. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
CMP401GRUZ-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 CMP401GSZ –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 CMP401GSZ-REEL –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 CMP402GRUZ-REEL –40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 CMP402GSZ –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 CMP402GSZ-REEL –40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16 1 Z = RoHS Compliant Part.
©2002–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C00267-0-3/16(B)
Rev. B | Page 8 of 8
