Datasheet HMC675LC3C (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 10 GHz Latched Comparator with RSCML Output Stage |
| Pages / Page | 10 / 6 — HMC675LC3C. 10 GHz LATCHED COMPARATOR. WITH RSCML OUTPUT STAGE. Absolute … |
| File Format / Size | PDF / 569 Kb |
| Document Language | English |
HMC675LC3C. 10 GHz LATCHED COMPARATOR. WITH RSCML OUTPUT STAGE. Absolute Maximum Ratings. Outline Drawing. Package Information
Model Line for this Datasheet
Text Version of Document
HMC675LC3C
v10.0514
10 GHz LATCHED COMPARATOR WITH RSCML OUTPUT STAGE Absolute Maximum Ratings
Input Supply Voltage (Vcci to GND) -0.5 V to +4 V Output Supply Voltage (Vcco to GND) -0.5 V to +4 V ELECTROSTATIC SENSITIVE DEVICE Positive Supply Voltage Differential OBSERVE HANDLING PRECAUTIONS T -0.5 V to +3.3 V (Vcci - Vcco) M Input Voltage -2 V to +2 V Differential Input Voltage -2 V to +2 V Input Voltage, Latch Enable -0.5 V to Vcci +0.5 V S - S Applied Voltage (HYS) Vee to GND R Maximum Input Current ±20 mA O Output Current 20 mA Junction Temperature 125 °C AT Continuous Pdiss (T = 85 °C) 0.816 W R (Derate 20.4 mW/°C above 85 °C) A Thermal Resistance (Rth) (Junction to Lead) 49 °C/W P Storage Temperature -65 °C to +150 °C Operating Temperature -40 °C to +85 °C ESD Sensitivity (HBM) Class 1A OM C
Outline Drawing
NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- 6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. PADDLE MUST BE SOLDERED TO Vee.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC675LC3C Alumina, White Gold over Nickel MSL3 [1] H675 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte ho.c n o e m : 1-800-ANALOG-D
v10.0514
10 GHz LATCHED COMPARATOR WITH RSCML OUTPUT STAGE Absolute Maximum Ratings
Input Supply Voltage (Vcci to GND) -0.5 V to +4 V Output Supply Voltage (Vcco to GND) -0.5 V to +4 V ELECTROSTATIC SENSITIVE DEVICE Positive Supply Voltage Differential OBSERVE HANDLING PRECAUTIONS T -0.5 V to +3.3 V (Vcci - Vcco) M Input Voltage -2 V to +2 V Differential Input Voltage -2 V to +2 V Input Voltage, Latch Enable -0.5 V to Vcci +0.5 V S - S Applied Voltage (HYS) Vee to GND R Maximum Input Current ±20 mA O Output Current 20 mA Junction Temperature 125 °C AT Continuous Pdiss (T = 85 °C) 0.816 W R (Derate 20.4 mW/°C above 85 °C) A Thermal Resistance (Rth) (Junction to Lead) 49 °C/W P Storage Temperature -65 °C to +150 °C Operating Temperature -40 °C to +85 °C ESD Sensitivity (HBM) Class 1A OM C
Outline Drawing
NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- 6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. PADDLE MUST BE SOLDERED TO Vee.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC675LC3C Alumina, White Gold over Nickel MSL3 [1] H675 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte ho.c n o e m : 1-800-ANALOG-D
