Datasheet ADP130 (Analog Devices) - 5

Data Sheet ADP130 ABSOLUTE MAXIMUM RATINGS
The junction-to-ambient thermal resistance (θJA) of the package
Table 3.
is based on modeling and calculation using a four-layer board.
Parameter Rating
The junction-to-ambient thermal resistance is highly dependent VIN to GND −0.3 V to +3.6 V on the application and board layout. In applications where high VBIAS to GND −0.3 V to +6 V maximum power dissipation exists, close attention to thermal EN to GND −0.3 V to VBIAS board design is required. The value of θJA may vary, depending on VOUT to GND −0.3 V to VIN PCB material, layout, and environmental conditions. The specified Storage Temperature Range −65°C to +150°C values of θJA are based on a four-layer, 4 in × 3 in circuit board. Operating Temperature Range −40°C to +125°C For details about board construction, refer to JEDEC JESD51-7. Operating Junction Temperature 125°C Ψ Lead Temperature (Soldering, 10 sec) 300°C JB is the junction-to-board thermal characterization parameter with units of °C/W. ΨJB of the package is based on modeling and Stresses above those listed under absolute maximum ratings calculation using a four-layer board. The JEDEC JESD51-12 may cause permanent damage to the device. This is a stress document, Guidelines for Reporting and Using Package Thermal rating only and functional operation of the device at these or Information, states that thermal characterization parameters are any other conditions above those indicated in the operational not the same as thermal resistances. ΨJB measures the component section of this specification is not implied. Exposure to absolute power flowing through multiple thermal paths rather than a single maximum rating conditions for extended periods may affect path, as in thermal resistance (θJB). Therefore, ΨJB thermal paths device reliability. include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real world
THERMAL DATA
applications. Maximum junction temperature (TJ) is calculated Absolute maximum ratings apply only individually, not in combi- from the board temperature (TB) and power dissipation (PD), using nation. The ADP130 may be damaged when junction temperature the following formula: limits are exceeded. Monitoring ambient temperature does not TJ = TB + (PD × ΨJB) guarantee that the junction temperature is within the specified temperature limits. In applications with high power dissipation Refer to the JEDEC JESD51-8 and JESD51-12 documents for and poor thermal resistance, the maximum ambient temperature more detailed information about ΨJB. may need to be derated.
THERMAL RESISTANCE
In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed θJA and ΨJB are specified for the worst-case conditions, that is, a the maximum limit as long as the junction temperature is within device soldered in a circuit board for surface-mount packages. specification limits. The junction temperature (TJ) of the device
Table 4. Thermal Resistance
is dependent on the ambient temperature (TA), the power
Package Type θJA ΨJB Unit
dissipation of the device (PD), and the junction-to-ambient thermal 5-Lead TSOT 170 43 °C/W resistance of the package (θJA). TJ is calculated using the following formula: TJ = TA + (PD × θJA)
ESD CAUTION
Rev. C | Page 5 of 20 Document Outline Features Applications Typical Application Circuits General Description Table of Contents Revision History Specifications Input and Output Capacitor: Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Bias Capacitor Input, Bias, and Output Capacitor Properties Undervoltage Lockout Enable Feature Current Limit and Thermal Overload Protection Thermal Considerations Junction Temperature Calculations PCB Layout Considerations Outline Dimensions Ordering Guide