Datasheet ADA4899-1 (Analog Devices) - 5

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Data Sheet ADA4899-1 ABSOLUTE MAXIMUM RATINGS Table 3.
The difference between the total drive power and the load
Parameter Rating
power is the drive power dissipated in the package. Supply Voltage 12.6 V PD = Quiescent Power + (Total Drive Power – Load Power) Power Dissipation See Figure 4  V V  V 2 Differential Input Voltage ±1.2 V P = V × I + × – D ( S S ) S OUT OUT   Differential Input Current ±10 mA 2 R R  L  L Storage Temperature Range –65°C to +150°C RMS output voltages should be considered. If RL is referenced to Operating Temperature Range –40°C to +125°C VS–, as in single-supply operation, the total drive power is VS × Lead Temperature (Soldering 10 sec) 300°C IOUT. If the rms signal levels are indeterminate, consider the Junction Temperature 150°C worst case, when VOUT = VS/4 for RL to midsupply. Stresses at or above those listed under Absolute Maximum 2 4 P = (V × I ) (V / ) S Ratings may cause permanent damage to the product. This is a + D S S R stress rating only; functional operation of the product at these L or any other conditions above those indicated in the operational In single-supply operation with RL referenced to VS–, the worst section of this specification is not implied. Operation beyond case is VOUT = VS/2. the maximum operating conditions for extended periods may Airflow increases heat dissipation, effectively reducing θJA. In affect product reliability. addition, more metal directly in contact with the package leads
MAXIMUM POWER DISSIPATION
from metal traces, through holes, ground, and power planes reduces the θJA. Soldering the exposed paddle to the ground The maximum safe power dissipation in the ADA4899-1 plane significantly reduces the overall thermal resistance of the package is limited by the associated rise in junction temperature package. (TJ) on the die. The plastic encapsulating the die locally reaches the junction temperature. At approximately 150°C, which is the Figure 4 shows the maximum safe power dissipation in the glass transition temperature, the plastic changes its properties. package vs. the ambient temperature for the exposed paddle Even temporarily exceeding this temperature limit may change (EPAD) 8-lead SOIC (70°C/W) and 8-lead LFCSP (70°C/W) the stresses that the package exerts on the die, permanently packages on a JEDEC standard 4-layer board. θJA values are shifting the parametric performance of the ADA4899-1. approximations. Exceeding a junction temperature of 150°C for an extended
4.0
period can result in changes in silicon devices, potentially
3.5
causing failure.
) (W
The still-air thermal properties of the package and PCB (θ
N 3.0
JA),
IO T
the ambient temperature (TA), and the total power dissipated in
PA 2.5
the package (PD) determine the junction temperature of the die.
ISSI
The junction temperature is calculated as
D 2.0 ER
T
W
J = TA + (PD × θJA)
1.5 LFCSP AND SOIC
The power dissipated in the package (P
M PO
D) is the sum of the
1.0 MU
quiescent power dissipation and the power dissipated in the
XI
package due to the load drive for all outputs. The quiescent
MA 0.5
003 power is the voltage between the supply pins (VS) times the 05720-
0.0
quiescent current (I
–40 –20 0 20 40 60 80 100 120
S). Assuming the load (RL) is referenced to midsupply, the total drive power is V
AMBIENT TEMPERATURE (°C)
S/2 × IOUT, some of which is dissipated in the package and some in the load (V Figure 4. Maximum Power Dissipation vs. Ambient Temperature OUT × IOUT).
ESD CAUTION
Rev. C | Page 5 of 20 Document Outline FEATURES APPLICATIONS CONNECTION DIAGRAMS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS WITH ±5 V SUPPLY SPECIFICATIONS WITH +5 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION PACKAGING INNOVATION DISABLE\ PIN APPLICATIONS INFORMATION UNITY-GAIN OPERATION RECOMMENDED VALUES FOR VARIOUS GAINS NOISE ADC DRIVER DISABLE\ PIN OPERATION ADA4899-1 MUX CIRCUIT CONSIDERATIONS PCB Layout Power Supply Bypassing Grounding OUTLINE DIMENSIONS ORDERING GUIDE