Datasheet SLG46826 (Dialog Semiconductor)
| Manufacturer | Dialog Semiconductor |
| Description | GreenPAK Programmable Mixed-signal Matrix with In System Programmability |
| Pages / Page | 188 / 1 — SLG46826. General Description. Key Features. Applications. Datasheet. … |
| File Format / Size | PDF / 3.1 Mb |
| Document Language | English |
SLG46826. General Description. Key Features. Applications. Datasheet. Revision 3.11. 10-Mar-2020
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SLG46826
GreenPAK Programmable Mixed-Signal Matrix with In-System Programmability
General Description
The SLG46826 provides a small, low power component for commonly used Mixed-Signal functions. The user creates the cir- cuit design by programming the multiple time Non-Volatile Memory (NVM) to configure the interconnect logic, the IOs, and the macrocells of the SLG46826. Dual power supply allows to flexibly interface two independent voltage domains.This highly ver- satile device allows a wide variety of Mixed-Signal functions to be designed within a very small, low power single integrated circuit.
Key Features
Analog Temperature Sensor Power-On Reset Two High Speed General Purpose Rail-to-Rail Analog In-System Programmability Comparators (ACMPxH) Multiple Time Programmable Memory Two Low Power General Purpose Rail-to-Rail Analog Wide Range Power Supply Comparators (ACMPxL) 2.5 V (±8 %) to 5 V (±10 %) VDD Two Voltage References 1.8 V (±5 %) to 5 V (±10 %) VDD2 (VDD2 ≤ VDD) Two Vref Outputs Operating Temperature Range: -40 °C to +85 °C Eleven Combination Function Macrocells RoHS Compliant/Halogen-Free Three Selectable DFF/LATCH or 2-bit LUTs Two Packages Available One Selectable Programmable Pattern Generator or 20-pin STQFN: 2 mm x 3 mm x 0.55 mm, 0.4 mm pitch 2-bit LUT 20-pin TSSOP: 6.5 mm x 6.4 mm x 1.2 mm, 0.65 mm Six Selectable DFF/LATCH or 3-bit LUTs pitch One Selectable Pipe Delay or Ripple Counter or 3-bit LUT Eight Multi-Function Macrocells Seven Selectable DFF/LATCH or 3-bit LUTs + 8-bit Delay/Counters One Selectable DFF/LATCH or 4-bit LUT + 16-bit Delay/Counter Serial Communications I2C Protocol Interface 2-kbit (256 x 8) I2C-Compatible (2-Wire) Serial EEPROM emulation with Software Write Protection Programmable Delay with Edge Detector Output Deglitch Filter or Edge Detector Three Oscillators 2.048 kHz Oscillator 2.048 MHz Oscillator 25 MHz Oscillator
Applications
Personal Computers and Servers PC Peripherals Consumer Electronics Data Communications Equipment Handheld and Portable Electronics Smartphones and Fitness Bands Notebook and Tablet PCs
Datasheet Revision 3.11 10-Mar-2020
1 of 188 © 2020 Dialog Semiconductor CFR0011-120-00 Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 20L 2.2 Pin Configuration - TSSOP-20L 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 Timing Characteristics 3.6 OSC Characteristics 3.6.1 OSC Specifications 3.6.2 OSC Power-On Delay 3.7 ACMP Specifications 3.8 Analog Temperature Sensor Characteristics 4 User Programmability 5 IO Pins 5.1 IO Pins 5.2 GPIO Pins 5.3 GPO Pins 5.4 GPI Pins 5.5 Pull-Up/Down Resistors 5.6 Fast Pull-up/down during Power-up 5.7 I2C Mode IO Structure (VDD or VDD2) 5.7.1 I2C Mode Structure (for SCL and SDA) 5.8 Matrix OE IO Structure (VDD or VDD2) 5.8.1 Matrix OE IO Structure (for IOs 1, 4, 5 with VDD, and IOs 8, 9, 10, 11, 12, 13, 14 with VDD2) 5.9 Register OE IO Structure (VDD or VDD2) 5.9.1 Register OE IO Structure (for IOs 0, 2, 3 with VDD) 5.10 Register OE IO Structure (VDD or VDD2) 5.10.1 Register OE IO Structure (for IO 6 with VDD, and IO 7 with VDD2) 5.11 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUT 7.1.2 Initial Polarity Operations 7.2 2-bit LUT or Programmable Pattern Generator 7.2.1 2-Bit LUT or PGen Macrocell Used as 2-Bit LUT 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.3.2 Initial Polarity Operations 7.4 3-Bit LUT or Pipe Delay/Ripple Counter Macrocell 7.4.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/LATCH with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY/FSM Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY7 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY7 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7 8.2.7 CNT/FSM Mode CNT/DLY0 8.2.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 4-Bit LUT or DFF/LATCH with 16-Bit Counter/Delay Macrocell 8.3.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram 8.3.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs 8.4 Wake and Sleep Controller 9 Analog Comparators 9.1 ACMP0H Block Diagram 9.2 ACMP1H Block Diagram 9.3 ACMP2L Block Diagram 9.4 ACMP3L Block Diagram 9.5 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector Output 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 12.3 Vref Block Diagram 12.4 VREF Load Regulation 13 Clocking 13.1 Oscillator general description 13.2 Oscillator0 (2.048 kHz) 13.3 Oscillator1 (2.048 MHz) 13.4 Oscillator2 (25 MHz) 13.5 CNT/DLY Clock Scheme 13.6 External Clocking 13.6.1 IO0 Source for Oscillator0 (2.048 kHz) 13.6.2 IO10 Source for Oscillator1 (2.048 MHz) 13.6.3 IO8 Source for Oscillator2 (25 MHz) 13.7 Oscillators Power-On Delay 13.8 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 Chip Configuration Data Protection 15.6 I2C Serial Command Register Map 15.7 I2C Additional Options 15.7.1 Reading Counter Data via I2C 15.7.2 I2C Expander 15.7.3 I2C Byte Write Bit Masking 16 Non-Volatile Memory 16.1 Serial NVM Write Operations 16.2 Serial NVM Read Operations 16.3 Serial NVM Erase Operations 16.4 Acknowledge Polling 16.5 Low power standby mode 16.6 Emulated EEPROM Write Protection 17 Analog Temperature Sensor 18 Register Definitions 18.1 Register Map 19 Package Top Marking System Definition 19.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 19.2 TSSOP-20 20 Package Information 20.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD 20.2 Package outlines for TSSOP 20L 173 MIL Green 20.3 STQFN and TSSOP Handling 20.4 Soldering Information 21 Ordering Information 21.1 Tape and Reel Specifications 21.2 Carrier Tape Drawing and Dimensions 21.3 STQFN-20L 21.4 TSSOP-20L 22 Layout Guidelines 22.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 22.2 TSSOP-20 Glossary Revision History
GreenPAK Programmable Mixed-Signal Matrix with In-System Programmability
General Description
The SLG46826 provides a small, low power component for commonly used Mixed-Signal functions. The user creates the cir- cuit design by programming the multiple time Non-Volatile Memory (NVM) to configure the interconnect logic, the IOs, and the macrocells of the SLG46826. Dual power supply allows to flexibly interface two independent voltage domains.This highly ver- satile device allows a wide variety of Mixed-Signal functions to be designed within a very small, low power single integrated circuit.
Key Features
Analog Temperature Sensor Power-On Reset Two High Speed General Purpose Rail-to-Rail Analog In-System Programmability Comparators (ACMPxH) Multiple Time Programmable Memory Two Low Power General Purpose Rail-to-Rail Analog Wide Range Power Supply Comparators (ACMPxL) 2.5 V (±8 %) to 5 V (±10 %) VDD Two Voltage References 1.8 V (±5 %) to 5 V (±10 %) VDD2 (VDD2 ≤ VDD) Two Vref Outputs Operating Temperature Range: -40 °C to +85 °C Eleven Combination Function Macrocells RoHS Compliant/Halogen-Free Three Selectable DFF/LATCH or 2-bit LUTs Two Packages Available One Selectable Programmable Pattern Generator or 20-pin STQFN: 2 mm x 3 mm x 0.55 mm, 0.4 mm pitch 2-bit LUT 20-pin TSSOP: 6.5 mm x 6.4 mm x 1.2 mm, 0.65 mm Six Selectable DFF/LATCH or 3-bit LUTs pitch One Selectable Pipe Delay or Ripple Counter or 3-bit LUT Eight Multi-Function Macrocells Seven Selectable DFF/LATCH or 3-bit LUTs + 8-bit Delay/Counters One Selectable DFF/LATCH or 4-bit LUT + 16-bit Delay/Counter Serial Communications I2C Protocol Interface 2-kbit (256 x 8) I2C-Compatible (2-Wire) Serial EEPROM emulation with Software Write Protection Programmable Delay with Edge Detector Output Deglitch Filter or Edge Detector Three Oscillators 2.048 kHz Oscillator 2.048 MHz Oscillator 25 MHz Oscillator
Applications
Personal Computers and Servers PC Peripherals Consumer Electronics Data Communications Equipment Handheld and Portable Electronics Smartphones and Fitness Bands Notebook and Tablet PCs
Datasheet Revision 3.11 10-Mar-2020
1 of 188 © 2020 Dialog Semiconductor CFR0011-120-00 Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 20L 2.2 Pin Configuration - TSSOP-20L 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 Timing Characteristics 3.6 OSC Characteristics 3.6.1 OSC Specifications 3.6.2 OSC Power-On Delay 3.7 ACMP Specifications 3.8 Analog Temperature Sensor Characteristics 4 User Programmability 5 IO Pins 5.1 IO Pins 5.2 GPIO Pins 5.3 GPO Pins 5.4 GPI Pins 5.5 Pull-Up/Down Resistors 5.6 Fast Pull-up/down during Power-up 5.7 I2C Mode IO Structure (VDD or VDD2) 5.7.1 I2C Mode Structure (for SCL and SDA) 5.8 Matrix OE IO Structure (VDD or VDD2) 5.8.1 Matrix OE IO Structure (for IOs 1, 4, 5 with VDD, and IOs 8, 9, 10, 11, 12, 13, 14 with VDD2) 5.9 Register OE IO Structure (VDD or VDD2) 5.9.1 Register OE IO Structure (for IOs 0, 2, 3 with VDD) 5.10 Register OE IO Structure (VDD or VDD2) 5.10.1 Register OE IO Structure (for IO 6 with VDD, and IO 7 with VDD2) 5.11 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUT 7.1.2 Initial Polarity Operations 7.2 2-bit LUT or Programmable Pattern Generator 7.2.1 2-Bit LUT or PGen Macrocell Used as 2-Bit LUT 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.3.2 Initial Polarity Operations 7.4 3-Bit LUT or Pipe Delay/Ripple Counter Macrocell 7.4.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/LATCH with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY/FSM Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY7 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY7 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7 8.2.7 CNT/FSM Mode CNT/DLY0 8.2.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 4-Bit LUT or DFF/LATCH with 16-Bit Counter/Delay Macrocell 8.3.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram 8.3.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs 8.4 Wake and Sleep Controller 9 Analog Comparators 9.1 ACMP0H Block Diagram 9.2 ACMP1H Block Diagram 9.3 ACMP2L Block Diagram 9.4 ACMP3L Block Diagram 9.5 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector Output 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 12.3 Vref Block Diagram 12.4 VREF Load Regulation 13 Clocking 13.1 Oscillator general description 13.2 Oscillator0 (2.048 kHz) 13.3 Oscillator1 (2.048 MHz) 13.4 Oscillator2 (25 MHz) 13.5 CNT/DLY Clock Scheme 13.6 External Clocking 13.6.1 IO0 Source for Oscillator0 (2.048 kHz) 13.6.2 IO10 Source for Oscillator1 (2.048 MHz) 13.6.3 IO8 Source for Oscillator2 (25 MHz) 13.7 Oscillators Power-On Delay 13.8 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 Chip Configuration Data Protection 15.6 I2C Serial Command Register Map 15.7 I2C Additional Options 15.7.1 Reading Counter Data via I2C 15.7.2 I2C Expander 15.7.3 I2C Byte Write Bit Masking 16 Non-Volatile Memory 16.1 Serial NVM Write Operations 16.2 Serial NVM Read Operations 16.3 Serial NVM Erase Operations 16.4 Acknowledge Polling 16.5 Low power standby mode 16.6 Emulated EEPROM Write Protection 17 Analog Temperature Sensor 18 Register Definitions 18.1 Register Map 19 Package Top Marking System Definition 19.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 19.2 TSSOP-20 20 Package Information 20.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD 20.2 Package outlines for TSSOP 20L 173 MIL Green 20.3 STQFN and TSSOP Handling 20.4 Soldering Information 21 Ordering Information 21.1 Tape and Reel Specifications 21.2 Carrier Tape Drawing and Dimensions 21.3 STQFN-20L 21.4 TSSOP-20L 22 Layout Guidelines 22.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 22.2 TSSOP-20 Glossary Revision History
