Datasheet HMC1131 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | GaAs, pHEMT, MMIC, Medium Power Amplifier, 24 GHz to 35 GHz |
| Pages / Page | 15 / 5 — Data Sheet. HMC1131. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. NIC. … |
| Revision | C |
| File Format / Size | PDF / 491 Kb |
| Document Language | English |
Data Sheet. HMC1131. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. NIC. GND. RFIN. RFOUT. TOP VIEW. (Not to Scale)
Model Line for this Datasheet
Text Version of Document
Data Sheet HMC1131 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 C DD DD DD DD C NI V V V V NI 24 23 22 21 20 19 NIC 1 18 NIC GND 2 17 GND RFIN 3 HMC1131 16 RFOUT TOP VIEW GND 4 (Not to Scale) 15 GND NIC 5 14 NIC NIC 6 13 NIC 7 8 9 10 11 12 C 1 C C 2 C NI GG NI NI GG NI V V NOTES 1. NIC = NOT INTERNALLY CONNECTED.
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2. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND.
13105- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 5 to 7, 9, 10, 12 to 14, NIC Not Internally Connected. However, all data was measured with these pins connected to RF/dc 18, 19, 24 ground externally. 2, 4, 15, 17 GND Ground. These pins must be connected to RF/dc ground. 3 RFIN RF Input. This pin is ac-coupled and matched to 50 Ω. 8 VGG1 Gate Bias Pin for the First and Second Stages. External bypass capacitors of 100 pF, 10 nF, and 4.7 µF are required for this pin. 11 VGG2 Gate Bias Pin for the Third and Fourth Stages. External bypass capacitors of 100 pF, 10 nF, and 4.7 µF are required for this pin. 16 RFOUT RF Output. This pin is ac-coupled and matched to 50 Ω. 20 to 23 VDD4 to VDD1 Drain Bias Voltage Pins. External bypass capacitors of 100 pF, 10 nF, and 4.7 µF are required for these pins. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground. Rev. C | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY ELECTRICAL SPECIFICATIONS 24 GHz TO 27 GHz FREQUENCY RANGE 27 GHz TO 35 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION EVALUATION PCB Bill of Materials TYPICAL APPLICATION CIRCUIT OUTLINE DIMENSIONS ORDERING GUIDE
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2. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND.
13105- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 5 to 7, 9, 10, 12 to 14, NIC Not Internally Connected. However, all data was measured with these pins connected to RF/dc 18, 19, 24 ground externally. 2, 4, 15, 17 GND Ground. These pins must be connected to RF/dc ground. 3 RFIN RF Input. This pin is ac-coupled and matched to 50 Ω. 8 VGG1 Gate Bias Pin for the First and Second Stages. External bypass capacitors of 100 pF, 10 nF, and 4.7 µF are required for this pin. 11 VGG2 Gate Bias Pin for the Third and Fourth Stages. External bypass capacitors of 100 pF, 10 nF, and 4.7 µF are required for this pin. 16 RFOUT RF Output. This pin is ac-coupled and matched to 50 Ω. 20 to 23 VDD4 to VDD1 Drain Bias Voltage Pins. External bypass capacitors of 100 pF, 10 nF, and 4.7 µF are required for these pins. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground. Rev. C | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY ELECTRICAL SPECIFICATIONS 24 GHz TO 27 GHz FREQUENCY RANGE 27 GHz TO 35 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION EVALUATION PCB Bill of Materials TYPICAL APPLICATION CIRCUIT OUTLINE DIMENSIONS ORDERING GUIDE
