Datasheet ADL5320 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | 400 MHz TO 2700 MHz ¼ Watt RF Driver Amplifier |
| Pages / Page | 20 / 7 — Data Sheet. ADL5320. TYPICAL PERFORMANCE CHARACTERISTICS. OIP3 (10dBm). … |
| Revision | B |
| File Format / Size | PDF / 919 Kb |
| Document Language | English |
Data Sheet. ADL5320. TYPICAL PERFORMANCE CHARACTERISTICS. OIP3 (10dBm). OIP3 (–40°C). OIP3 (+25°C). dB ( 3. OIP3 (+85°C). , OIP. P1dB. Bm)
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Text Version of Document
Data Sheet ADL5320 TYPICAL PERFORMANCE CHARACTERISTICS 50 50 30 OIP3 (10dBm) 45 OIP3 (–40°C) ) 45 OIP3 (+25°C) 29 m 40 dB ( 3 35 40 OIP3 (+85°C) 28 , OIP 30 dB P1dB Bm) Bm) 1 d d 25 35 27 3 ( B ( ); P IP 1d dB 20 O P F ( 30 26 15 , N GAIN P1dB (–40°C) IN 10 GA 25 P1dB (+85°C) 25 5 NF
003 006
P1dB (+25°C) 0
05840-
20 24
05840-
800 820 840 860 880 900 920 940 960 800 820 840 860 880 900 920 940 960 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 4. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 7. OIP3 and P1dB vs. Frequency and Temperature, 800 MHz to 960 MHz 800 MHz to 960 MHz
19.0 50 930MHz 18.5 880MHz 18.0 46 17.5 –40°C 17.0 +25°C 42 B) d Bm) d 850MHz 830MHz 16.5 +85°C N ( 960MHz 3 ( AI IP G 16.0 O 38 15.5 15.0 34 14.5
004 007 05870-
14.0
05840-
30 800 820 840 860 880 900 920 940 960 –2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (MHz) POUT (dBm)
Figure 5. Gain vs. Frequency and Temperature, 800 MHz to 960 MHz Figure 8. OIP3 vs. POUT and Frequency, 800 MHz to 960 MHz
–25.0 0 7.0 –25.5 –5 6.5 S22 6.0 –26.0 –10 B) 5.5 d –26.5 –15 22 ( 5.0 +85°C B) d B) –27.0 –20 d ( 4.5 12 ( AND S +25°C S S12 B) NF 4.0 –27.5 –25 d 11 ( S11 S 3.5 –40°C –28.0 –30 3.0 –28.5 –35 2.5
005 008
–29.0 –40 2.0
05840-
700 750 800 850 900 950 1000
05840-
700 750 800 850 900 950 1000 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 6. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 9. Noise Figure vs. Frequency and Temperature, Isolation (S12) vs. Frequency, 800 MHz to 960 MHz 800 MHz to 960 MHz Rev. B | Page 7 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
003 006
P1dB (+25°C) 0
05840-
20 24
05840-
800 820 840 860 880 900 920 940 960 800 820 840 860 880 900 920 940 960 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 4. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 7. OIP3 and P1dB vs. Frequency and Temperature, 800 MHz to 960 MHz 800 MHz to 960 MHz
19.0 50 930MHz 18.5 880MHz 18.0 46 17.5 –40°C 17.0 +25°C 42 B) d Bm) d 850MHz 830MHz 16.5 +85°C N ( 960MHz 3 ( AI IP G 16.0 O 38 15.5 15.0 34 14.5
004 007 05870-
14.0
05840-
30 800 820 840 860 880 900 920 940 960 –2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (MHz) POUT (dBm)
Figure 5. Gain vs. Frequency and Temperature, 800 MHz to 960 MHz Figure 8. OIP3 vs. POUT and Frequency, 800 MHz to 960 MHz
–25.0 0 7.0 –25.5 –5 6.5 S22 6.0 –26.0 –10 B) 5.5 d –26.5 –15 22 ( 5.0 +85°C B) d B) –27.0 –20 d ( 4.5 12 ( AND S +25°C S S12 B) NF 4.0 –27.5 –25 d 11 ( S11 S 3.5 –40°C –28.0 –30 3.0 –28.5 –35 2.5
005 008
–29.0 –40 2.0
05840-
700 750 800 850 900 950 1000
05840-
700 750 800 850 900 950 1000 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 6. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 9. Noise Figure vs. Frequency and Temperature, Isolation (S12) vs. Frequency, 800 MHz to 960 MHz 800 MHz to 960 MHz Rev. B | Page 7 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
