Datasheet ADL5724 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 12.7 GHz to 15.4 GHz, Low Noise Amplifier |
| Pages / Page | 12 / 5 — Data Sheet. ADL5724. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VCC1 1. … |
| File Format / Size | PDF / 326 Kb |
| Document Language | English |
Data Sheet. ADL5724. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VCC1 1. 8 VCC2. GND 2. 7 OUTN. INPT 3. TOP VIEW. 6 OUTP. (Not to Scale)
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Data Sheet ADL5724 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VCC1 1 8 VCC2 GND 2 7 OUTN ADL5724 INPT 3 TOP VIEW 6 OUTP (Not to Scale) RBIAS 4 5 DNC NOTES 1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED PAD MUST BE SOLDERED TO A LOW IMPEDANCE GROUND PLANE. 3. THE DEVICE NUMBER ON THE FIGURE DOES NOT INDICATE THE LABEL ON
002
THE PACKAGE. REFER TO THE PIN 1 INDICATOR FOR THE PIN LOCATIONS.
14317- Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VCC1 1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. 2 GND Ground. 3 INPT RF Input. This is a 50 Ω single-ended input. 4 RBIAS Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to place the RBIAS resistor as close to the pin as possible. 5 DNC Do Not Connect. Do not connect to this pin. 6, 7 OUTP, OUTN RF Outputs. These pins are 100 Ω differential outputs. 8 VCC2 3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. EPAD (EP) Exposed Pad. The exposed pad must be soldered to a low impedance ground plane. Rev. 0 | Page 5 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
002
THE PACKAGE. REFER TO THE PIN 1 INDICATOR FOR THE PIN LOCATIONS.
14317- Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VCC1 1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. 2 GND Ground. 3 INPT RF Input. This is a 50 Ω single-ended input. 4 RBIAS Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to place the RBIAS resistor as close to the pin as possible. 5 DNC Do Not Connect. Do not connect to this pin. 6, 7 OUTP, OUTN RF Outputs. These pins are 100 Ω differential outputs. 8 VCC2 3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. EPAD (EP) Exposed Pad. The exposed pad must be soldered to a low impedance ground plane. Rev. 0 | Page 5 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
