Datasheet HMC943APM5E (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | >1.5 W (34 dBm), 24 GHz to 34 GHz, GaAs, pHEMT, MMIC, Power Amplifier |
| Pages / Page | 18 / 4 — HMC943APM5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL … |
| Revision | B |
| File Format / Size | PDF / 439 Kb |
| Document Language | English |
HMC943APM5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter1. Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
link to page 5 link to page 5 link to page 18
HMC943APM5E Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter1 Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDx) 6.5 V (PCB) design and operating environment. Careful attention to Gate Bias Voltage (VGx) −2 V to 0 V dc PCB thermal design is required. Radio Frequency (RF) Input Power (RFIN) 20 dBm θJC is the junction to case thermal resistance. Output Load Standing Wave Ratio (VSWR) 7:1 Junction Temperature to Maintain 1 Million 175°C
Table 4. Thermal Resistance
Hour Mean Time to Failure (MTTF)
Package Type θJC Unit
Maximum Peak Reflow Temperature (MSL3)2 260°C CG-32-21 8.6 °C/W Nominal Junction Temperature 146.5°C (T 1 A = 85°C, VDx = 5.5 V) Thermal resistance (θJC) is determined by simulation under the following Continuous Power Dissipation, P conditions: the heat transfer is due solely to thermal conduction from the DISS (TA = 10.5 W channel, through the ground pad, to the PCB, and the ground pad is held 85°C, Derate 116.3 m W/°C Above 85°C) constant at the operating temperature of 85°C. Storage Temperature Range −65°C to +150°C
ESD CAUTION
Operating Temperature Range −40°C to +85°C ESD Sensitivity (Human Body Model) Class 0B, passed 150 V 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the Absolute Maximum Rating is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 18 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION POWER DETECTION EVALUATION BOARD EVALUATION BOARD SCHEMATIC OUTLINE DIMENSIONS ORDERING GUIDE
HMC943APM5E Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter1 Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDx) 6.5 V (PCB) design and operating environment. Careful attention to Gate Bias Voltage (VGx) −2 V to 0 V dc PCB thermal design is required. Radio Frequency (RF) Input Power (RFIN) 20 dBm θJC is the junction to case thermal resistance. Output Load Standing Wave Ratio (VSWR) 7:1 Junction Temperature to Maintain 1 Million 175°C
Table 4. Thermal Resistance
Hour Mean Time to Failure (MTTF)
Package Type θJC Unit
Maximum Peak Reflow Temperature (MSL3)2 260°C CG-32-21 8.6 °C/W Nominal Junction Temperature 146.5°C (T 1 A = 85°C, VDx = 5.5 V) Thermal resistance (θJC) is determined by simulation under the following Continuous Power Dissipation, P conditions: the heat transfer is due solely to thermal conduction from the DISS (TA = 10.5 W channel, through the ground pad, to the PCB, and the ground pad is held 85°C, Derate 116.3 m W/°C Above 85°C) constant at the operating temperature of 85°C. Storage Temperature Range −65°C to +150°C
ESD CAUTION
Operating Temperature Range −40°C to +85°C ESD Sensitivity (Human Body Model) Class 0B, passed 150 V 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the Absolute Maximum Rating is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 18 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION POWER DETECTION EVALUATION BOARD EVALUATION BOARD SCHEMATIC OUTLINE DIMENSIONS ORDERING GUIDE
