Datasheet HMC906A (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 27.3 - 33.5 GHz |
| Pages / Page | 12 / 8 — HMC906A. GaAs pHEMT MMIC 2 WATT. POWER AMPLIFIER, 27.3 - 33.5 GHz. … |
| File Format / Size | PDF / 601 Kb |
| Document Language | English |
HMC906A. GaAs pHEMT MMIC 2 WATT. POWER AMPLIFIER, 27.3 - 33.5 GHz. Outline Drawing. Die Packaging Information
Model Line for this Datasheet
Text Version of Document
HMC906A
v02.0617
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 27.3 - 33.5 GHz Outline Drawing
ip H r - C e w o p r & A e lin s - r ie lif p m A noTes:
Die Packaging Information
[1] 1. All Dimensions Are in inCHes [mm] 2. Die THiCKness is .004” standard Alternate 3. TYpiCAl BonD pAD is .004” sQUAre 4. BACKsiDe meTAlliZATion: GolD Gp-1 (Gel pack) [2] 5. BonD pAD meTAlliZATion: GolD 6. BACKsiDe meTAl is GroUnD. [1] Refer to the “Packaging Information” section on our 7. ConneCTion noT reQUireD for UnlABeleD BonD pADs. website for die packaging dimensions. 8. oVerAll Die siZe ± 0.002” [2] For alternate packaging information contact Analog Devices Inc. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
8
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications P1dB vs. Supply Voltage P1dB vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Absolute Maximum Ratings Outline Drawing Die Packaging Information Pad Descriptions Application Circuit Assembly Diagram
v02.0617
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 27.3 - 33.5 GHz Outline Drawing
ip H r - C e w o p r & A e lin s - r ie lif p m A noTes:
Die Packaging Information
[1] 1. All Dimensions Are in inCHes [mm] 2. Die THiCKness is .004” standard Alternate 3. TYpiCAl BonD pAD is .004” sQUAre 4. BACKsiDe meTAlliZATion: GolD Gp-1 (Gel pack) [2] 5. BonD pAD meTAlliZATion: GolD 6. BACKsiDe meTAl is GroUnD. [1] Refer to the “Packaging Information” section on our 7. ConneCTion noT reQUireD for UnlABeleD BonD pADs. website for die packaging dimensions. 8. oVerAll Die siZe ± 0.002” [2] For alternate packaging information contact Analog Devices Inc. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
8
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications P1dB vs. Supply Voltage P1dB vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Absolute Maximum Ratings Outline Drawing Die Packaging Information Pad Descriptions Application Circuit Assembly Diagram
