Datasheet HMC1132PM5E (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 27 GHz to 32 GHz, GaAs, pHEMT, MMIC Power Amplifier |
| Pages / Page | 17 / 4 — HMC1132PM5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL … |
| File Format / Size | PDF / 351 Kb |
| Document Language | English |
HMC1132PM5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter. Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
link to page 9 link to page 17
HMC1132PM5E Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDDx) 6.5 V (PCB) design and operating environment. Careful attention to Gate Voltage (VGG) −2.5 V to +0.5 V PCB thermal design is required. Radio Frequency Input Power (RFIN)1 18 dBm θJC is the junction to case thermal resistance. Continuous Power Dissipation (PDISS), 5.17 W T 2 BASE = 85°C (Derate 57.47 mW/°C
Table 4. Thermal Resistance
Above 85°C)
Package θJC Unit
Output Load Voltage Standing Wave 7:1 CG-32-21 17.4 °C/W Ratio (VSWR) Storage Temperature Range −65°C to +150°C 1 Thermal resistance (θJC) was determined by simulation under the following conditions: the heat transfer is due solely to thermal conduction from the Operating Temperature Range −55°C to +85°C channel, through the ground paddle, to the PCB, and the ground paddle is Peak Reflow Temperature, Moisture 260°C held constant at the operating temperature of 85°C. Sensitivity Level 3 (MSL3)3 Electrostatic Discharge (ESD) Sensitivity
ESD CAUTION
Human Body Model (HBM) Class 0B, passed 150 V Junction Temperature to Maintain 175°C 1 Million Hour Mean Time to Failure (MTTF) Nominal Junction Temperature 141.55°C (T 2 BASE = 85°C, VDDx = 5 V) 1 Maximum input power is limited to 18 dBm or thermal limits constrained by maximum power dissipation (see Figure 31), whichever is lower. 2 TBASE is the actual temperature on the package base. 3 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 17 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Application Circuit Evaluation Board Bill of Materials Evaluation Board Schematic Outline Dimensions Ordering Guide
HMC1132PM5E Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDDx) 6.5 V (PCB) design and operating environment. Careful attention to Gate Voltage (VGG) −2.5 V to +0.5 V PCB thermal design is required. Radio Frequency Input Power (RFIN)1 18 dBm θJC is the junction to case thermal resistance. Continuous Power Dissipation (PDISS), 5.17 W T 2 BASE = 85°C (Derate 57.47 mW/°C
Table 4. Thermal Resistance
Above 85°C)
Package θJC Unit
Output Load Voltage Standing Wave 7:1 CG-32-21 17.4 °C/W Ratio (VSWR) Storage Temperature Range −65°C to +150°C 1 Thermal resistance (θJC) was determined by simulation under the following conditions: the heat transfer is due solely to thermal conduction from the Operating Temperature Range −55°C to +85°C channel, through the ground paddle, to the PCB, and the ground paddle is Peak Reflow Temperature, Moisture 260°C held constant at the operating temperature of 85°C. Sensitivity Level 3 (MSL3)3 Electrostatic Discharge (ESD) Sensitivity
ESD CAUTION
Human Body Model (HBM) Class 0B, passed 150 V Junction Temperature to Maintain 175°C 1 Million Hour Mean Time to Failure (MTTF) Nominal Junction Temperature 141.55°C (T 2 BASE = 85°C, VDDx = 5 V) 1 Maximum input power is limited to 18 dBm or thermal limits constrained by maximum power dissipation (see Figure 31), whichever is lower. 2 TBASE is the actual temperature on the package base. 3 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 17 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Application Circuit Evaluation Board Bill of Materials Evaluation Board Schematic Outline Dimensions Ordering Guide
