link to page 6 link to page 6 link to page 16 Data SheetHMC1099ABSOLUTE MAXIMUM RATINGS Table 5. Stresses at or above those listed under Absolute Maximum Parameter1Rating Ratings may cause permanent damage to the product. This is a Drain Bias Voltage (VDD) 32 V dc stress rating only; functional operation of the product at these Gate Bias Voltage (VGG) −8 V to 0 V dc or any other conditions above those indicated in the operational Radio Frequency (RF) Input Power (RFIN) 33 dBm section of this specification is not implied. Operation beyond Maximum Forward Gate Current 4 mA the maximum operating conditions for extended periods may Maximum Voltage Standing Wave Ratio 6:1 affect product reliability. (VSWR)2 Channel Temperature 225°C Maximum Peak Reflow Temperature (MSL3)3 260°C ESD CAUTION Continuous Power Dissipation, PDISS (TA = 85°C, 12.5 W Derate 89 mW/°C Above 85°C) Thermal Resistance (Junction to Back of 11.2°C/W Paddle) Storage Temperature Range −55°C to +150°C Operating Temperature Range −40°C to +85°C ESD Sensitivity (Human Body Model) Class 1B, passed 500 V 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the Absolute Maximum Rating is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 Restricted by maximum power dissipation. 3 See the Ordering Guide for additional information. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL SUPPLY CURRENT BY VDD ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT EVALUATION PCB BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE