V 1700 V DSC2M0045170PI D@ 25˚C 72 A R 45 mΩ Silicon Carbide Power MOSFETDS(on)C2MTM MOSFET Technology N-Channel Enhancement Mode FeaturesPackage • Optimized package with separate driver source pin TAB • 8mm of creepage distance between drain and source Drain • High Blocking Voltage with Low On-Resistance • High Speed Switching with Low Capacitances • Easy to Parallel and Simple to Drive • Halogen Free, RoHS Compliant BenefitsDrain • (Pin 1, TAB) Reduce switching losses and minimize gate ringing • Higher system efficiency 12 3 4 • DS S G Reduce cooling requirements • Increase power density • Increase system switching frequency Gate(Pin 4)ApplicationsDriverPowerSourceSource • (Pin 3)(Pin 2) 1500V Solar Inverters • Switch Mode Power Supplies • High Voltage DC/DC converters Part NumberPackageMarking • Pulsed Power Applications C2M0045170P TO-247-4 Plus C2M0045170P Maximum Ratings (T = 25 ˚C unless otherwise specified) C SymbolParameterValueUnitTest ConditionsNote VDSmax Drain - Source Voltage 1700 V VGS = 0 V, ID = 100 μA VGSmax Gate - Source Voltage (dynamic) -10/+25 V AC (f >1 Hz) Note: 1 VGSop Gate - Source Voltage (Static) -5/+20 V Static Note: 2 72 V I GS =20 V, TC = 25˚C Fig. 19 D Continuous Drain Current A 48 VGS =20 V, TC = 100˚C ID(pulse) Pulsed Drain Current 160 A Pulse width tP limited by Tjmax Fig. 22 P Power Dissipation 520 W T =25˚C, T = 150 ˚C Fig. 20 D C J T , T Operating Junction and Storage Temperature -40 to J stg +150 ˚C T Solder Temperature 260 ˚C 1.6mm (0.063”) from case for 10s L Note (1): When using MOSFET Body Diode V = -5V/+25V GSmax Note (2): MOSFET can also safely operate at 0/+20V 1 C2M0045170P Rev. -, 04-2018