Datasheet AIS2IH (STMicroelectronics) - 6
| Manufacturer | STMicroelectronics |
| Description | MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications |
| Pages / Page | 63 / 6 — AIS2IH. Mechanical and electrical specifications. 2.1. Mechanical … |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
AIS2IH. Mechanical and electrical specifications. 2.1. Mechanical characteristics. Table 3. Mechanical characteristics. Symbol
Model Line for this Datasheet
Text Version of Document
link to page 6 link to page 6 link to page 7 link to page 7 link to page 7 link to page 7 link to page 7 link to page 6 link to page 7 link to page 7
AIS2IH Mechanical and electrical specifications 2 Mechanical and electrical specifications 2.1 Mechanical characteristics
@ Vdd = 3.0 V, T = -40 °C to +115 °C unless otherwise noted. The product is factory calibrated at 3.0 V.
Table 3. Mechanical characteristics Symbol Parameter Test conditions Min. Typ.(1) Max. Unit
±2 ±4 FS Measurement range g ±8 ±16 @ FS ±2 g in High-Performance Mode and 0.244 all low-power modes except Low-Power Mode 1 @ FS ±4 g in High-Performance Mode and 0.488 all low-power modes except Low-Power Mode 1 @ FS ±8 g in High-Performance Mode and 0.976 all low-power modes except Low-Power Mode 1 So Nominal sensitivity @ FS ±16 g in High-Performance Mode and mg/digit 1.952 all low-power modes except Low-Power Mode 1 @ FS ±2 g in Low-Power Mode 1 0.976 @ FS ±4 g in Low-Power Mode 1 1.952 @ FS ±8 g in Low-Power Mode 1 3.904 @ FS ±16 g in Low-Power Mode 1 7.808 in High-Performance Mode -10 +10 So % Sensitivity tolerance - long term(2) % in Low-Power Modes 1/2/3/4 -15 +15 Noise density - An @ FS ±2 g, @ 25 °C 90 130 µg/√Hz High-Performance Mode(3)(5) Low-Power Mode 4 1.6 2.9 RMS noise - Low-Power Modes(4) Low-Power Mode 3 2.1 3.8 RMS mg(RMS) @ FS ±2 g, @ 25 °C(5) Low-Power Mode 2 3.0 5.7 Low-Power Mode 1 5.5 11.0 TyOff Zero-g level offset accuracy(6) @ 25 °C ±20 mg OFF_Acc Offset accuracy - long term(2) -300 +300 mg TCO Zero-g offset change vs. temperature ±0.2 mg/°C TCS Sensitivity change vs. temperature ±0.01 %/°C best-fit straight line NL Non-linearity(7) ±0.3 %FS @ FS ±2 g, @ 25 °C Cx Cross-axis sensitivity(7) @ FS ±2 g, @ 25 °C ±0.4 ST Self-test positive difference @ FS ±16 g, Vdd from 1.62 V to 3.6 V 70 1500 mg 1. Typical specifications are not guaranteed. 2. Long term includes the following conditions: post solder, drift in temperature in the range [-40°C; +115°C] and over life.
DS12421
-
Rev 4 page 6/63
Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures
AIS2IH Mechanical and electrical specifications 2 Mechanical and electrical specifications 2.1 Mechanical characteristics
@ Vdd = 3.0 V, T = -40 °C to +115 °C unless otherwise noted. The product is factory calibrated at 3.0 V.
Table 3. Mechanical characteristics Symbol Parameter Test conditions Min. Typ.(1) Max. Unit
±2 ±4 FS Measurement range g ±8 ±16 @ FS ±2 g in High-Performance Mode and 0.244 all low-power modes except Low-Power Mode 1 @ FS ±4 g in High-Performance Mode and 0.488 all low-power modes except Low-Power Mode 1 @ FS ±8 g in High-Performance Mode and 0.976 all low-power modes except Low-Power Mode 1 So Nominal sensitivity @ FS ±16 g in High-Performance Mode and mg/digit 1.952 all low-power modes except Low-Power Mode 1 @ FS ±2 g in Low-Power Mode 1 0.976 @ FS ±4 g in Low-Power Mode 1 1.952 @ FS ±8 g in Low-Power Mode 1 3.904 @ FS ±16 g in Low-Power Mode 1 7.808 in High-Performance Mode -10 +10 So % Sensitivity tolerance - long term(2) % in Low-Power Modes 1/2/3/4 -15 +15 Noise density - An @ FS ±2 g, @ 25 °C 90 130 µg/√Hz High-Performance Mode(3)(5) Low-Power Mode 4 1.6 2.9 RMS noise - Low-Power Modes(4) Low-Power Mode 3 2.1 3.8 RMS mg(RMS) @ FS ±2 g, @ 25 °C(5) Low-Power Mode 2 3.0 5.7 Low-Power Mode 1 5.5 11.0 TyOff Zero-g level offset accuracy(6) @ 25 °C ±20 mg OFF_Acc Offset accuracy - long term(2) -300 +300 mg TCO Zero-g offset change vs. temperature ±0.2 mg/°C TCS Sensitivity change vs. temperature ±0.01 %/°C best-fit straight line NL Non-linearity(7) ±0.3 %FS @ FS ±2 g, @ 25 °C Cx Cross-axis sensitivity(7) @ FS ±2 g, @ 25 °C ±0.4 ST Self-test positive difference @ FS ±16 g, Vdd from 1.62 V to 3.6 V 70 1500 mg 1. Typical specifications are not guaranteed. 2. Long term includes the following conditions: post solder, drift in temperature in the range [-40°C; +115°C] and over life.
DS12421
-
Rev 4 page 6/63
Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures
