Datasheet ADG5408-EP, ADG5409-EP (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | High Voltage Latch-Up Proof, 4-/8-Channel Multiplexers |
| Pages / Page | 18 / 10 — ADG5408-EP/ADG5409-EP. Enhanced Product. PIN CONFIGURATIONS AND FUNCTION … |
| File Format / Size | PDF / 340 Kb |
| Document Language | English |
ADG5408-EP/ADG5409-EP. Enhanced Product. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. 12 GND. ADG5408-EP. S1 2. 11 VDD. S2 3. TOP VIEW
Model Line for this Datasheet
Text Version of Document
ADG5408-EP/ADG5409-EP Enhanced Product PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS N 0 1 2 E A A A 6 5 4 3 1 1 1 1 V 1 SS 12 GND ADG5408-EP S1 2 11 VDD S2 3 TOP VIEW 10 S5 (Not to Scale) S3 4 9 S6 5 6 7 8 4 8 7 S D S S NOTES 1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED THAT THE PAD BE
003
SOLDERED TO THE SUBSTRATE, V
97-
SS.
33 1 Figure 2. ADG5408-EP Pin Configuration
Table 8. ADG5408-EP Pi n Function Descriptions Pin No. Mnemonic Description
15 A0 Logic Control Input. 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 2 S1 Source Terminal 1. This pin can be an input or an output. 3 S2 Source Terminal 2. This pin can be an input or an output. 4 S3 Source Terminal 3. This pin can be an input or an output. 5 S4 Source Terminal 4. This pin can be an input or an output. 6 D Drain Terminal. This pin can be an input or an output. 7 S8 Source Terminal 8. This pin can be an input or an output. 8 S7 Source Terminal 7. This pin can be an input or an output. 9 S6 Source Terminal 6. This pin can be an input or an output. 10 S5 Source Terminal 5. This pin can be an input or an output. 11 VDD Most Positive Power Supply Potential. 12 GND Ground (0 V) Reference. 13 A2 Logic Control Input. 14 A1 Logic Control Input. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG5408-EP Truth T able A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. 0 | Page 10 of 18 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY ±20 V DUAL SUPPLY 12 V SINGLE SUPPLY 36 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR D ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
003
SOLDERED TO THE SUBSTRATE, V
97-
SS.
33 1 Figure 2. ADG5408-EP Pin Configuration
Table 8. ADG5408-EP Pi n Function Descriptions Pin No. Mnemonic Description
15 A0 Logic Control Input. 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 2 S1 Source Terminal 1. This pin can be an input or an output. 3 S2 Source Terminal 2. This pin can be an input or an output. 4 S3 Source Terminal 3. This pin can be an input or an output. 5 S4 Source Terminal 4. This pin can be an input or an output. 6 D Drain Terminal. This pin can be an input or an output. 7 S8 Source Terminal 8. This pin can be an input or an output. 8 S7 Source Terminal 7. This pin can be an input or an output. 9 S6 Source Terminal 6. This pin can be an input or an output. 10 S5 Source Terminal 5. This pin can be an input or an output. 11 VDD Most Positive Power Supply Potential. 12 GND Ground (0 V) Reference. 13 A2 Logic Control Input. 14 A1 Logic Control Input. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG5408-EP Truth T able A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. 0 | Page 10 of 18 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY ±20 V DUAL SUPPLY 12 V SINGLE SUPPLY 36 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR D ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
