Datasheet NCV5230 (ON Semiconductor) - 7

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NCV5230 THERMAL CONSIDERATIONS
negative supply. The resistor can be selected between 1.0 W When using the NCV5230, the internal power dissipation to 100 kW to provide any required supply current over the capabilities of each package should be considered. indicated range. In addition, a small varying voltage on the ON Semiconductor does not recommend operation at die bias current control pin could be used for such exotic things temperatures above 110°C in the SO package because of its as changing the gain−bandwidth for voltage controlled low inherently smaller package mass. Die temperatures of pass filters or amplitude modulation. Furthermore, control 150°C can be tolerated in all the other packages. With this over the slew rate and the rise time of the amplifier can be in mind, the following equation can be used to estimate the obtained in the same manner. This control over the slew rate die temperature: also changes the settling time and overshoot in pulse Tj + Tamb ) (PD qJA) (eq. 1) response applications. The settling time to 0.1% changes from 5.0 ms at low bias to 2.0 ms at high bias. The supply Where current control can also be utilized for wave−shaping Tamb= Ambient Temperature applications such as for pulse or triangular waveforms. The Tj = Die Temperature gain−bandwidth can be varied from between 250 kHz at low PD = Power Dissipation bias to 600 kHz at high bias current. The slew rate range is = (ICC x VCC) 0.08 V/ms at low bias and 0.25 V/ms at high bias. qJA = Package Thermal Resistance = 270°C/W for SO−8 in PC Board Mounting See the packaging section for information regarding other 800 mA) 700 methods of mounting. 600 qJA − 100°C/W for the plastic DIP. 500 The maximum supply voltage for the part is 15 V and the 400 typical supply current is 1.1 mA (1.6 mA max). For Y CURRENT ( operation at supply voltages other than the maximum, see 300 the data sheet for ICC versus VCC curves. The supply current is somewhat proportional to temperature and varies no more 200 than 100 mA between 25°C and either temperature extreme. Operation at higher junction temperatures than that POWER SUPPL recommended is possible but will result in lower Mean Time 100 Between Failures (MTBF). This should be considered 100 200 300 400 500 600700 before operating beyond recommended die temperature UNITY GAIN BANDWIDTH (kHz) because of the overall reliability degradation.
Figure 3. Unity Gain Bandwidth vs. Power Supply DESIGN TECHNIQUES AND APPLICATIONS Current for VCC =
±
0.9 V
The NCV5230 is a very user−friendly amplifier for an engineer to design into any type of system. The supply 1.4 current adjust pin (Pin 5) can be left open or tied through a VCC − 15V TA − 25°C 1.2 pot or fixed resistor to the most negative supply (i.e., ground VCC − 12V for single supply or to the negative supply for split supplies). 1.0 VCC − 9V The minimum supply current is achieved by leaving this pin VCC − 6V 0.8 open. In this state it will also decrease the bandwidth and VCC − 3V slew rate. When tied directly to the most negative supply, the 0.6 VCC − 2V device has full bandwidth, slew rate and ICC. The CURRENT (mA) 0.4 programming of the current−control pin depends on the VCC − 1.8V I CC trade−offs which can be made in the designer’s application. 0.2 The graphs in Figures 3 and 4 will help by showing 0.0 bandwidth versus ICC. As can be seen, the supply current can 100 101 102 103 104 105 be varied anywhere over the range of 100 mA to 600 mA for RADJ (W) a supply voltage of 1.8 V. An external resistor can be
Figure 4. ICC Current vs. Bias Current Adjusting
inserted between the current control pin and the most
Resistor for Several Supply Voltages www.onsemi.com 7