Datasheet STTH1L06 (STMicroelectronics) - 7
| Manufacturer | STMicroelectronics |
| Description | Turbo 2 ultrafast high voltage rectifier |
| Pages / Page | 9 / 7 — STTH1L06. Package information. Table 7. SMB dimensions. Dimensions. Ref. … |
| File Format / Size | PDF / 112 Kb |
| Document Language | English |
STTH1L06. Package information. Table 7. SMB dimensions. Dimensions. Ref. Millimeters. Inches. Min. Max. Figure 17
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Text Version of Document
STTH1L06 Package information Table 7. SMB dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. D
A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087
E
c 0.15 0.40 0.006 0.016
A1
D 3.30 3.95 0.130 0.156
C A2
E 5.10 5.60 0.201 0.220
L b
E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059
Figure 17. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Table 8. DO-41 (plastic) dimensions Dimensions Ref. Millimeters Inches ØD ØB Min. Max. Min. Max.
A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107
C A C
C 25.4 1 D 0.71 0.86 0.028 0.034 Doc ID 8321 Rev 4 7/9 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history
A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087
E
c 0.15 0.40 0.006 0.016
A1
D 3.30 3.95 0.130 0.156
C A2
E 5.10 5.60 0.201 0.220
L b
E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059
Figure 17. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Table 8. DO-41 (plastic) dimensions Dimensions Ref. Millimeters Inches ØD ØB Min. Max. Min. Max.
A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107
C A C
C 25.4 1 D 0.71 0.86 0.028 0.034 Doc ID 8321 Rev 4 7/9 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history
