Datasheet STTH1L06 (STMicroelectronics) - 8
| Manufacturer | STMicroelectronics |
| Description | Turbo 2 ultrafast high voltage rectifier |
| Pages / Page | 9 / 8 — Ordering information. STTH1L06. 3 Ordering. information. Table 9. Order … |
| File Format / Size | PDF / 112 Kb |
| Document Language | English |
Ordering information. STTH1L06. 3 Ordering. information. Table 9. Order code. Marking. Package. Weight. Base qty. Delivery mode. 4 Revision
Model Line for this Datasheet
Text Version of Document
Ordering information STTH1L06 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode
STTH1L06 STTH1L06 DO-41 0.34 g 2000 Ammopack STTH1L06RL STTH1L06 DO-41 0.34 g 5000 Tape and reel STTH1L06U BL6 SMB 0.11 g 2500 Tape and reel STTH1L06A HL6 SMA 0.068 g 5000 Tape and reel
4 Revision history Table 10. Document revision history Date Revision Changes
Jul-2002 3C Last issue. 30-Sep-2009 4 Updated table 8 package dimensions. 8/9 Doc ID 8321 Rev 4 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history
STTH1L06 STTH1L06 DO-41 0.34 g 2000 Ammopack STTH1L06RL STTH1L06 DO-41 0.34 g 5000 Tape and reel STTH1L06U BL6 SMB 0.11 g 2500 Tape and reel STTH1L06A HL6 SMA 0.068 g 5000 Tape and reel
4 Revision history Table 10. Document revision history Date Revision Changes
Jul-2002 3C Last issue. 30-Sep-2009 4 Updated table 8 package dimensions. 8/9 Doc ID 8321 Rev 4 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history
