Datasheet Si1308EDL (Vishay) - 8

AN813 Vishay Siliconix Single-Channel LITTLE FOOT
R
SC-70 3-Pin and 6-Pin MOSFET Recommended Pad Pattern and Thermal Peformance
INTRODUCTION BASIC PAD PATTERNS This technical note discusses pin-outs, package outlines, pad See Application Note 826, Recommended Minimum Pad patterns, evaluation board layout, and thermal performance Patterns With Outline Drawing Access for Vishay Siliconix for single-channel LITTLE FOOT power MOSFETs in the MOSFETs, (http://www.vishay.com/doc?72286) for the basic SC-70 package. These new Vishay Siliconix devices are pad layout and dimensions for the 3-pin SC-70 and the 6-pin intended for small-signal applications where a miniaturized SC-70. These pad patterns are sufficient for the low-power package is needed and low levels of current (around 350 mA) applications for which this package is intended. Increasing the need to be switched, either directly or by using a level shift pad pattern has little effect on thermal resistance for the 3-pin configuration. Vishay provides these single devices with a device, reducing it by only 10% to 15%. But for the 6-pin range of on-resistance specifications and in both traditional device, increasing the pad patterns yields a reduction in 3-pin and new 6-pin versions. The new 6-pin SC-70 package thermal resistance on the order of 35% when using a 1-inch enables improved on-resistance values and enhanced square with full copper on both sides of the printed circuit board thermal performance compared to the 3-pin package. (PCB). The availability of four drain leads rather than the traditional single drain lead allows a better thermal path from the package to the PCB and external environment. PIN-OUT Figure 1 shows the pin-out description and Pin 1 identification EVALUATION BOARDS FOR THE SINGLE for the single-channel SC-70 device in both 3-pin and 6-pin configurations. The pin-out of the 6-pin device allows the use SC70-3 AND SC70-6 of four pins as drain leads, which helps to reduce on-resistance Figure 2 shows the 3-pin and 6-pin SC-70 evaluation boards and junction-to-ambient thermal resistance. (EVB). Both measure 0.6 inches by 0.5 inches. Their copper pad traces are the same as described in the previous section,
SOT-323 SOT-363
Basic Pad Patterns. Both boards allow interrogation from the
SC-70 (3-LEADS) SC-70 (6-LEADS)
outer pins to 6-pin DIP connections, permitting test sockets to Top View Top View be used in evaluation testing. G 1 D 1 6 The thermal performance of the single SC-70 has been 3 D D 2 5 measured on the EVB for both the 3-pin and 6-pin devices, the results shown in Figures 3 and 4. The minimum recommended footprint on the evaluation board was compared with the S 2 G 3 4 industry standard of 1-inch square FR4 PCB with copper on both sides of the board.
FIGURE 1.
For package dimensions see outline drawings: SC-70 (3-Leads) (http://www.vishay.com/doc?71153) SC-70 (6-Leads) (http://www.vishay.com/doc?71154)
Front of Board SC70-3 Back of Board, SC70-3 and SC70-6 Front of Board SC70-6
ChipFETr ChipFETr vishay.com
FIGURE 2.
Document Number: 71236 www.vishay.com 12-Dec-03
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