Datasheet MC10EP16, MC100EP16 (ON Semiconductor) - 10
| Manufacturer | ON Semiconductor |
| Description | 3.3 V/5 V ECL Differential Receiver/Driver |
| Pages / Page | 13 / 10 — PACKAGE DIMENSIONS. SOIC−8 NB. SCALE 1:1. −X−. −Y−. MILLIMETERS. INCHES. … |
| File Format / Size | PDF / 357 Kb |
| Document Language | English |
PACKAGE DIMENSIONS. SOIC−8 NB. SCALE 1:1. −X−. −Y−. MILLIMETERS. INCHES. DIM. MIN. MAX. N X 45. SEATING. PLANE. −Z−. GENERIC. MARKING DIAGRAM*
Model Line for this Datasheet
Text Version of Document
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOIC−8 NB
8 CASE 751−07 1 ISSUE AK DATE 16 FEB 2011
SCALE 1:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*
8 8 8 8 XXXXX XXXXX XXXXXX XXXXXX ALYWX ALYWX AYWW 1.52 AYWW G G 0.060 1 1 1 1
IC IC Discrete Discrete (Pb−Free) (Pb−Free)
7.0 4.0 XXXXX = Specific Device Code XXXXXX = Specific Device Code 0.275 0.155 A = Assembly Location A = Assembly Location L = Wafer Lot Y = Year Y = Year WW = Work Week W = Work Week G = Pb−Free Package G = Pb−Free Package 0.6 1.270 *This information is generic. Please refer to 0.024 0.050 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may SCALE 6:1 ǒ mm Ǔ inches not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42564B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SOIC−8 NB PAGE 1 OF 2 onsemi
and are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS SOIC−8 NB
8 CASE 751−07 1 ISSUE AK DATE 16 FEB 2011
SCALE 1:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*
8 8 8 8 XXXXX XXXXX XXXXXX XXXXXX ALYWX ALYWX AYWW 1.52 AYWW G G 0.060 1 1 1 1
IC IC Discrete Discrete (Pb−Free) (Pb−Free)
7.0 4.0 XXXXX = Specific Device Code XXXXXX = Specific Device Code 0.275 0.155 A = Assembly Location A = Assembly Location L = Wafer Lot Y = Year Y = Year WW = Work Week W = Work Week G = Pb−Free Package G = Pb−Free Package 0.6 1.270 *This information is generic. Please refer to 0.024 0.050 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may SCALE 6:1 ǒ mm Ǔ inches not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42564B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SOIC−8 NB PAGE 1 OF 2 onsemi
and are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
