Datasheet BCV62 (Nexperia) - 10
| Manufacturer | Nexperia |
| Description | PNP General-Purpose Double Transistors |
| Pages / Page | 14 / 10 — Nexperia. BCV62. PNP general-purpose double transistors. 11. Soldering. … |
| File Format / Size | PDF / 816 Kb |
| Document Language | English |
Nexperia. BCV62. PNP general-purpose double transistors. 11. Soldering. Fig 17. Reflow soldering footprint SOT143B
Model Line for this Datasheet
Text Version of Document
Nexperia BCV62 PNP general-purpose double transistors 11. Soldering
3.25 0.6 (3×) 0.5 (3×) 1.9 solder lands 0.7 0.6 (3×) (3×) solder resist 2 3 solder paste occupied area 0.7 0.6 Dimensions in mm 0.75 0.95 0.9 1 sot143b_fr
Fig 17. Reflow soldering footprint SOT143B
4.45 2.2 1.2 (3×) 1.425 (3×) solder lands solder resist 4.6 2.575 occupied area Dimensions in mm 1.425 preferred transport direction during soldering 1 1.2 sot143b_fw
Fig 18. Wave soldering footprint SOT143B
BCV62 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 4 — 26 July 2010 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
3.25 0.6 (3×) 0.5 (3×) 1.9 solder lands 0.7 0.6 (3×) (3×) solder resist 2 3 solder paste occupied area 0.7 0.6 Dimensions in mm 0.75 0.95 0.9 1 sot143b_fr
Fig 17. Reflow soldering footprint SOT143B
4.45 2.2 1.2 (3×) 1.425 (3×) solder lands solder resist 4.6 2.575 occupied area Dimensions in mm 1.425 preferred transport direction during soldering 1 1.2 sot143b_fw
Fig 18. Wave soldering footprint SOT143B
BCV62 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 4 — 26 July 2010 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
