30 A Low-Side RF MOSFET Driver IXRFD630Absolute Maximum RatingsParameterValueParameterValue Supply Voltage V Maximum Junction Temperature 150° C CC 30V Input Voltage Level V Operating Temperature Range -40° C to 85° C IN -5V to VCC + 0.3V All Other Pins -0.3V to VCC +0.3V Thermal Impedance (Junction to Case) RӨJC 0.25° C/W Power Dissipation TA (AMBIENT) ≤ 25C 2W Note: Operating the device outside of the “Absolute Maximum Rat- T 100W ings” may cause permanent damage. Typical values indicate condi- C (CASE) ≤ 25C tions for which the device is intended to be functional but do not Storage Temperature -40°C to 150°C guarantee specific performance limits. The guaranteed specifica- tions apply only for the test conditions listed. Exposure to absolute Soldering Lead Temperature 300°C maximum conditions for extended periods may impact device reli- (10 seconds maximum) ability. Electrical CharacteristicsUnless otherwise noted, TA = 25° C, 8V < VCC < 30V. All voltage measurements with respect to GND. IXRFD630 configured as described in Test Conditions.SymbolParameterTest ConditionsMinTypMaxUnits VIH High input voltage V C C = 1 5 V f o r t y pical value 3 . 5 3 V VIL Low input voltage VCC = 15V for typical value 2 . 8 0.8 V VHYS Input hysteresis 0.23 V VIN Input voltage range -5 VCC + 0.3 V IIN Input current 0V≤ VIN ≤VCC -10 10 µA VOH High output voltage V C C 0.025 - V VOL Low output voltage 0.025 V ROH High output resistance VCC = 15V IOUT = 100mA 0.25 Ω ROL Low output resistance VCC = 15V IOUT = 100mA 0.17 Ω IPEAK Peak output current VCC = 15V 28 A IDC Continuous output current 2.5 A VCC=15V CL=1nF 4 ns tR Rise time CL=2nF 5 ns VCC =15V CL=1nF 4 ns tF Fall time CL=2nF 5.5 ns tONDLY ON propagation delay VCC =15V CL=2nF 24 ns tOFFDLY OFF propagation delay VCC =15V CL=2nF 22 ns PWmin Minimum pulse width FWHM VCC =15V CL=1nF 8 ns VCC Power supply voltage Recommended 8 15 18 V V CC = 15V, VIN = 0V 0 1 mA ICC Power supply current VCC = 15V, VIN = 3.5V 1 3 mA VCC = 15V, VIN = VCC 0 5 mA CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling. 2