TS432 Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONSSOT-23 3.10 A 2.80 0.20 4 0.10 B 3 1.70 3.00 4 1.40 2.60 DETAIL A 0.50 (3X) 0.95 0.35 0.20 C A B 1.90 (3X) GAUGE PLANE 1.30 0.25 1.20 1.00 1.00 0.10 C 8° 3X 0° C 0.10 C 0.60 0.30 0.00 SEATING PLANE (0.65) 0.95 DETAIL A, ROTATED -90° (SCALE 2:1) 2.35 3 0.85 P/N YML 1 2 0.85 SUGGESTED PAD LAYOUT MARKING DIAGRAM NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN MILLIMETERS. P/N = PRODUCT DEVICE CODE 2. DIMENSIONING AND TOLERANCING Y = YEAR CODE PER ASME Y14.5M-1994. M = MONTH CODE FOR HALOGEN FREE PRODUCT 3. PACKAGE OUTLINE REFERENCE: O =JAN P =FEB Q=MAR R = APR EIAJ ED-7500A, SC-59. S =MAY T =JUN U=JUL V = AUG 4 MOLDED PLASTIC BODY DIMENSIONS DO W =SEP X =OCT Y=NOV Z = DEC NOT INCLUDE MOLD FLASH, L = LOT CODE PROTRUSIONS OR GATE BURRS. 5. DWG NO. REF: HQ2SD07-SOT23IC-104 REV A. 8 Version: G2408