Datasheet TL432LI-Q1 (Texas Instruments) - 4

TL431LI-Q1 TL432LI-Q1
SNVSBA4A – MAY 2019 – REVISED NOVEMBER 2019
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VKA Cathode Voltage(2) 37 V IKA Continuos Cathode Current Range –10 18 mA II(ref) Reference Input Current –5 10 mA TJ Operating Junction Temperature Range –40 150 C Tstg Storage Temperature Range –65 150 C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to ANODE, unless otherwise noted.
7.2 ESD Ratings VALUE UNIT
Electrostatic Human body model (HBM), per AEC Q100-002(1) ±4000 V(ESD) V discharge Charged-device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification
7.3 Recommended Operating Conditions MIN MAX UNIT
VKA Cathode Voltage VREF 36 V IKA Continuous Cathode Current Range 0.6 15 mA TL43xLIxQ –40 125 C TA Operating Free-Air Temperature(1) TL43xLIxE –40 150 C (1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ can affect reliability. Please see the Semiconductor and IC Package Thermal Metrics Application Report for more information.
7.4 Thermal Information TL43xLI THERMAL METRIC(1) DBZ UNIT 3 PINS
RθJA Junction-to-ambient thermal resistance 371.7 C/W RθJC(top) Junction-to-case (top) thermal resistance 145.9 C/W RθJB Junction-to-boardthermal resistance 104.7 C/W ψJT Junction-to-top characterization resistance 23.9 C/W ψJB Junction-to-board characterization resistance 102.9 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report. 4 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TL431LI-Q1 TL432LI-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Temperature Coefficient 8.2 Dynamic Impedance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.4 Device Functional Modes 9.4.1 Open Loop (Comparator) 9.4.2 Closed Loop 10 Applications and Implementation 10.1 Application Information 10.2 Typical Applications 10.2.1 Comparator With Integrated Reference 10.2.2 Design Requirements 10.2.3 Detailed Design Procedure 10.2.3.1 Basic Operation 10.2.3.2 Output Voltage and Logic Input Level 10.2.4 Application Curves 10.2.5 Precision LED Lighting Current Sink Regulator 10.2.5.1 Design Requirements 10.2.5.2 Detailed Design Procedure 10.2.6 Shunt Regulator/Reference 10.2.6.1 Design Requirements 10.2.6.2 Detailed Design Procedure 10.2.6.3 Application Curves 10.2.7 Isolated Flyback with Optocoupler 10.2.7.1 Design Requirements 10.2.7.2 Detailed Design Procedure 10.3 System Examples 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Device Support 13.1.1 Device Nomenclature 13.2 Documentation Support 13.2.1 Related Documentation 13.3 Related Links 13.4 Receiving Notification of Documentation Updates 13.5 Support Resources 13.6 Trademarks 13.7 Electrostatic Discharge Caution 13.8 Glossary 14 Mechanical, Packaging, and Orderable Information