Datasheet OP400 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Offset, Low Power Quad Op Amp |
| Pages / Page | 16 / 5 — Data Sheet. OP400. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter. Rating. … |
| Revision | I |
| File Format / Size | PDF / 342 Kb |
| Document Language | English |
Data Sheet. OP400. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter. Rating. THERMAL RESISTANCE. Table 5. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
Data Sheet OP400 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating THERMAL RESISTANCE
Supply Voltage ±20 V θJA is specified for worst-case mounting conditions, that is, θJA is Differential Input Voltage ±30 V specified for device in socket for CERDIP and PDIP packages; Input Voltage Supply voltage θJA is specified for device soldered to printed circuit board for Output Short-Circuit Duration Continuous SOIC package. Storage Temperature Range P, Y, S Packages −65°C to +150°C
Table 5. Thermal Resistance
Lead Temperature (Soldering 60 sec) 300°C
Package Type θJA θJC Unit
Junction Temperature (T 14-Pin Ceramic DIP (Y) 94 10 °C/W J) Range −65°C to +150°C Operating Temperature Range 14-Pin Plastic DIP (P) 76 33 °C/W OP400A −55°C to +125°C 16-Pin SOIC (S) 88 23 °C/W OP400E, OP400F −25°C to +85°C OP400G 0°C to 70°C
ESD CAUTION
OP400H −40°C to +85°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply to both dice and packaged parts, unless otherwise noted. Rev. H | Page 5 of 16 Document Outline Features General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Applications Dual Low Power Instrumentation Amplifier Bipolar Current Transmitter Differential Output Instrumentation Amplifier Multiple Output Tracking Voltage Reference Outline Dimensions Ordering Guide SMD Parts and Equivalents
Supply Voltage ±20 V θJA is specified for worst-case mounting conditions, that is, θJA is Differential Input Voltage ±30 V specified for device in socket for CERDIP and PDIP packages; Input Voltage Supply voltage θJA is specified for device soldered to printed circuit board for Output Short-Circuit Duration Continuous SOIC package. Storage Temperature Range P, Y, S Packages −65°C to +150°C
Table 5. Thermal Resistance
Lead Temperature (Soldering 60 sec) 300°C
Package Type θJA θJC Unit
Junction Temperature (T 14-Pin Ceramic DIP (Y) 94 10 °C/W J) Range −65°C to +150°C Operating Temperature Range 14-Pin Plastic DIP (P) 76 33 °C/W OP400A −55°C to +125°C 16-Pin SOIC (S) 88 23 °C/W OP400E, OP400F −25°C to +85°C OP400G 0°C to 70°C
ESD CAUTION
OP400H −40°C to +85°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply to both dice and packaged parts, unless otherwise noted. Rev. H | Page 5 of 16 Document Outline Features General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Applications Dual Low Power Instrumentation Amplifier Bipolar Current Transmitter Differential Output Instrumentation Amplifier Multiple Output Tracking Voltage Reference Outline Dimensions Ordering Guide SMD Parts and Equivalents
