Mitsubishi Electric to Launch MOSFET-type Super-mini DIPIPM

Mitsubishi PSM03S93E5/-A/-C PSM0593E5/-A/-C

Contributes to reduced power consumption, miniaturization and lower cost of small-capacity motors for refrigerators, other products

Mitsubishi Electric Corporation announced it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances. The module uses a metal oxide semiconductor field effect transistor (MOSFET) switching device featuring low power-on voltage in low current regions. Sales will begin on March 1.

With optimized low-loss-drive ICs and a high-heat dissipation design, the module will help to reduce power consumption, advance miniaturization and lower the cost of inverter systems for small-capacity motor drive applications.

Mitsubishi-PSM0593E5

Product Features

Reduced power consumption in small-capacity inverter systems

  • Power-on voltage in low current regions is reduced by about 60% compared to Mitsubishi Electric's existing "PS219B2" DIPIPM at 0.5A and 25 degrees Celsius, by employing a MOSFET switching device.
     
  • Reduction of recovered-power loss by optimizing the MOSFET process.
     
  • Reduction of IC power loss by optimizing the control IC.
     

High reliability through high-heat dissipation structure

  • Suppression of channel temperature rise by reducing power loss of switching device and applying a high-heat dissipation insulation sheet.

Cost reduction and miniaturization of final product

  • Facilitation of thermal radiation via the high-heat dissipation design.
     
  • Reduction of external components thanks to built-in bootstrap diode (BSD) with current limiting resistor.

Sale Schedule

Model
Specification
Shipment date
PSM03S93E5/-A/-C
3A/500V
March 1, 2013
PSM05S93E5/-A/-C
5A/500V

Main Specifications

Model
PSM03S93E5/-A/-C
PSM0593E5/-A/-C
Specification
3A/500V
5A/500V
Dimensions
24 × 38 × 3.5 mm (same as super-mini DIPIPM)
Built-in Chips
MOSFET × 6 forming a three-phase bridge,
HVIC × 1, LVIC × 1and Bootstrap Diode × 3
Functions
Protection against short circuits, control power-supply undervoltage and
over-heating (LVIC monitoring ); and error output
Others
Divided-source-type N-side MOSFET

In 1997, Mitsubishi Electric first commercialized its DIPIPM transfer-mold-type intelligent power module, which has contributed greatly to miniaturization and energy-savings in inverter systems. The technology has gained increased importance because annual power consumption has become an important index of energy-saving performance in consumer appliances, such as refrigerators. Needs are increasing for reducing loss in rated power, and also in low current regions where a high percentage of power use is concentrated.

mitsubishielectric.com