CMOS image sensor camera module saves space in mobile devices
Toshiba Electronics Europe has announced the industry’s thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel (MP) imaging ideal for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry’s lowest profile at just 4.7 mm.
Achieving today’s high-resolution CMOS image sensors requires a larger optical size for corresponding lenses which results in a thicker camera module and a bulkier mobile device. The conventional method for lowering the camera module height uses only optical lens design, which becomes problematic because resolution drops around the corners of the image area. However, the TCM9930MD resolves this drop in resolution with the use of an image pre-processing LSI (companion) chip that processes distortion correction and performs image resolution reconstruction(1). Additionally, the TCM9930MD achieves its low profile by using a flip-chip structure for the image sensor. Toshiba opted to use flip chip packaging because it allows for a large number of interconnects, with shorter distances than wire, which greatly reduces assembling area and package height.
Samples of the new module will be available in May 2013, with mass production scheduled for the end of the year.
The resolution reconstruction approach used in the camera module is a ‘superreconstruction’ technology developed by Toshiba’s corporate research and development centre. The same technology has been applied to Toshiba televisions.
Key Specifications
- Model name: TCM9930MD
- Resolution: 13 mega pixel
- Optical size: 1/3.07 inch
- Pixel size: 1.12 micrometer BSI
- Module size: 8.5 × 8.5 × 4.7 mm(AF unit)
- Lens: 4 plastic lens
- Sample schedule: May, 2013
