Toshiba Introduces Industry's First HDMI to MIPI DSI Converter IC

Toshiba TC358779XBG

Toshiba Corporation announced that it has launched "TC358779XBG", the industry's first High Definition Multimedia Interface (HDMI) to MIPI Display Serial Interface (DSI) bridge IC for consumer and industrial applications that use small form-factor LCD displays. Samples are now available, with mass production scheduled to start in December this year.

Toshiba - TC358779XBG

The "TC358779XBG" converts HDMI video input and outputs it as a MIPI DSI video stream output. This will promote adoption of MIPI-compliant small form-factor LCD displays in applications that include game accessories, wearable computers and head-mounted products.

The product also integrates video preprocessing functions – video de-interlacing, scaling and format conversion – and supports multiple audio interfaces, including the I2S, TDM, S/PDIF and MIPI Serial Low-power Inter-chip Media Bus (SLIMbus) audio formats.

Key Features

  • The industry's first device that converts HDMI video input and outputs it as a MIPI DSI video stream
  • Integrated video de-interlacing, scaling and format conversion contribute to lower memory bandwidth and video processing requirements on host processors.
  • HDMI 1.4 RX support:
    • Up to 1080P @ 60fps video format (RGB, YCbCr444: 24-bpp, YCbCr422 24-bpp)
    • HDCP 1.3
    • 3D support
  • Available in any of the four audio interfaces: I2S, TDM, SPDIF or SLIMbus
  • Maximum 1Gbps/lane link speed MIPI DSI interface
  • Maximum 165MHz clock speed HDMI interface

Applications

  • A wide range of consumer electronics and industrial applications, including mobile devices, digital cameras and gaming accessories, head-mounted products and other wearable computers.

Main Specifications

  • Input Interface: HDMI 1.4, Max. clock speed 165MHz
  • Output Video Interface: MIPI DSI 4 Data lanes (Up to 1Gbps/lane)
  • Output Audio Interface: I2S, TDM, SPDIF or SLIMbus
  • Source Voltage: MIPI/Core/PLL: 1.2V HDMI: 3.3V I/O: 1.8V to 3.3V
  • Package: FPGA80 (7mm × 7mm, 0.65mm pitch)
  • Mass Production Schedule: December, 2013

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