- No Thicker than Four Sheets of Paper, National Chips in the World's Thinnest Packages Enable Super-Slim Cell Phones, Flat-Panel Displays, PDAs, MP3 Players and Other Devices
- National Introduces New Amplifier Microphone Products in Ultra-Thin Packages
National Semiconductor Corporation announced the world's thinnest integrated circuit (IC) packages. As thin as four sheets of office paper, National products in these new micro SMD (Surface-Mount Device) and LLP® (Leadless Leadframe Packages) enable original equipment manufacturers to build smaller, thinner and lighter cell phones, displays, MP3 players, PDAs and other devices.
The new 0.4 mm ultra-thin packages are available today in National's analog amplifier products; they will be available in the second half of 2004 for National's wireless products. The company also plans to offer ultra-thin chip packages for its portable power products. National's new package types are available with traditional tin-lead or state-of-the-art lead-free interconnect options.
National: A Track Record of Innovating Advanced IC Package Technologies
National's micro SMD chip-scale package is available in 4-bump to 36-bump packages. National's LLP packages are available in 6-lead to 80-lead package types. Micro SMD and LLP packages offer OEMs the advantages of small footprint, improved electrical, thermal and moisture sensitivity, reduced noise and easier board assembly. During 2004, National plans to introduce even thinner 0.3 and 0.2 mm package types, with bump counts up to 100.
Key Technical Specifications for National's New Amplifiers in Ultra-Thin Packages
The LMV1032 is National's new ultra-thin audio amplifier series for small form-factor electret microphones designed to replace the junction field effect transistor (JFET) preamp currently in use. The addition of a third pin in electret microphones that incorporate the LMV1032 allows for a dramatic reduction in supply current compared to JFET-equipped electret microphones. The LMV1032 series is ideal for extended battery life applications, such as digital cameras and MP3 players. Microphone supply current is reduced to 60 µA, assuring longer battery life.
The LMV1032 series is guaranteed for supply voltages from 1.7V to 5V and has fixed voltage gains of 6 dB, 15 dB and 25 dB. It also offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature. The devices are offered in a space-saving 4-bump ultra-thin micro SMD lead- free package.
National also introduced the LMV1012UP, an ultra-thin version of its popular "Amp-in-a-mic" product. The new LMV1012UP is the market's first amplifier in a microphone integrated directly inside 2- and 3-wire electret condenser microphones (ECMs). These amplifiers replace JFETs for longer battery life and greater noise immunity, resulting in better microphone performance. These products are ideal for use in microphones in mobile handsets, headset accessories and other portable microphone applications.
