Module and Chipset Platforms Feature Industry-Leading Integration of Audio, Power Management and Bluetooth Capabilities
National Semiconductor introduced the most highly integrated system solution for GSM/GPRS handsets. The system solution integrates critical analog and wireless capabilities - such as audio, power management, BluetoothTM connectivity, imaging interface, baseband and RF --- into module and chipset platforms for mobile phone manufacturers. Leveraging National's expertise in the design, packaging and manufacture of analog products, the integrated module and chipset provide high quality sound, longer battery life and imaging functionality for the complete spectrum of GSM/GPRS phones. The integrated chipset offers customers the ability to fully customize their solutions; the module is designed for ODMs/OEMs who need a complete GSM/GPRS engine for fast time-to-market. Both the chipset and module come with full development kits.
The GSM/GPRS module, the LMX3888, is being demonstrated now at the 3GSM World Congress in National's booth, K-17, in Hall 4.
The LMX3888 module is compact, power-efficient and highly integrated, boasting features such as on-chip polyphonic ringer, speakerphone and stereo MP3 capabilities. The module is based on National's GSM/GPRS chipset, which consists of the LMX3413 analog power unit, the LMX3415 digital baseband, and a complete quad-band, very low power radio.
A dual-band module, National's LMX3888 is designed to provide phone manufacturers with complete, turnkey solutions for designing GSM/GPRS mobile handsets. The module is a complete mobile phone engine, packaged, tested and ready for placement in a phone. Using a fully integrated chipset module, OEMs and ODMs can focus their design energies on optimizing the display, antenna, plastics and user interface of the phone design, enabling faster time to market with minimal research.
The LMX3888 includes an integrated Bluetooth Link Manager, USB, CMOS camera interface, SD/MMC interface, voice recognition, voice memo, handsfree speakerphone, MP3, EMS and MMS in a sophisticated GSM/GPRS Class B-10 product offering. The LMX3888 measures just 33 mm by 38 mm by 3.6 mm and is packaged as a single-sided, BGA-mounted package designed for high volume manufacturing and easy placement on many styles of phone boards. Other versions of the module will support tri- and quad-band operation.
The GSM/GPRS Module Development Kit
National also has a GSM/GPRS module development kit designed for mobile phone manufacturers who are interested in customizing and reducing the cost of their handset designs for an even greater degree of competitiveness and flexibility. The kit includes a module development board, module reference design, and development and test tools.
Availability
The chipset and module are currently sampling to select customers and will be available for general sampling in June 2003.
