The new USB 3.0 interface enables computing, consumer and mobile communication devices to link up and transfer data at speeds of up to 5Gbps. This makes USB 3.0 ten times faster than its predecessor USB 2.0. However, when USB 3.0 interfaces are used regularly, electrostatic discharge (ESD) poses a major threat to reliability as it can be quickly routed to internal IC/ASIC circuitry and cause damage.This results in hard failures, latent damage or temporary malfunctions of electronic equipment. The cost of recalling, replacing or repairing equipment damaged by ESD may be several times higher than the actual cost of the original product. Customers also regard failures of this kind as poor product quality.
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| ESD 3V3U4ULC in a TSLP-9-1 package |
Infineon's new TVS diode ESD 3V3U4ULC is a dedicated solution that effectively protects USB 3.0 and other high-speed interfaces against ESD. It is optimized for all available types of USB 3.0 connectors, from standard A and B through to micro-connector families.
Features
- ESD multi-strike absorption capability up to ±20kV exceeding IEC61000-4-2
- Best ESD protection performance with just 11V clamping voltage and >50% better dynamic resistance than competitor devices
- Ultralow capacitance of 0.4pF ensures optimal quality of high-speed signal lines
- Miniaturized array package measuring just 2.3 × 1.0 × 0.31mm
- Flow-through package enables easy PCB layout
Applications
- Motherboards
- Notebooks
- External storage devices
- Storage controllers
- Hard disk drives
- HD video systems
- PCI express cards
- Game consoles, digital cameras
- Printers and scanners
