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Microsemi SmartFusion2 Development Kit (SF2-DEV-KIT)

Microsemi » SF2-DEV-KIT

Main Features of Kit or Board
ParameterValue
Base componentMicrosemi
Category, bit32-bit
Supported familiesSmartFusion2
Board peripherals
  • RS-232 driver
  • RS-485 driver
  • I/O pins
  • I2C interface
  • SPI
  • USB
  • USB-device
  • Ethernet
  • PCI-E
  • JTAG/BDM
  • Flash
  • SDRAM
  • NANDFlash
  • user buttons
  • user LEDs
  • Power Management

Microsemi's SmartFusion2 Development Kit offers a full-featured development board for SmartFusion2 System-on-Chip (SoC) FPGAs, which integrate inherently reliable flash-based FPGA fabric, a 166 MHz ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip.

The board contains numerous transceivers to support the built-in Microcontroller Subsystem such as HS USB 2.0 OTG, CAN RS232, RS484, and IEEE1588 time stamping and Sync E capable Triple Speed Ethernet PHY's. The kit will ship with a wall mounted power supply but also has the option to be powered through PoE (Power over Ethernet), includes a 16-bit ADC and has IEEE 1588 Packet Time-stamping capabilities. There is also 512MB of on-board DDR3 memory and SPI Flash to utilize SmartFusion2's memory management system. The SERDES blocks can be access via the PCI Edge Connector or High Speed SMP Connectors.

Kit Capabilities:

    Evaluate the 5G SERDES on SmartFusion2 through the available SMP connectors.
        SmartFusion2 devices provide the highest 5G SERDES densities in the industry.
    Build PCI Express Endpoint applications through the x4 card edge fingers provided on the board.
    Evaluate DDR3 and GPIO performance.
        SmartFusion2 provides the highest General purpose and 3.3V I/Os in the industry.
    Build sub-systems that require:
        1588 Timing Synchronization
        Power over Ethernet
        Industrial Motor Control
        Gigabit Ethernet/10 Gigabit Ethernet switches
        Mixed Signal Power Management

SmartFusion2 Development Kit board includes:

  • Devices On-Board
    • M2S050T-1FGG896
      • 50K LUT, 256Kbit eNVM, 1.5Mbit SRAM, and additional distributed SRAM in the FPGA fabric and external memory controller
      • Peripherals include Triple Speed Ethernet, USB 2.0, SPI, CAN, DMAs, I2Cs, UARTs, timers
      • 16x 5Gbps SERDES, PCIe, XAUI/XGXS+ Native SERDES
    • ZL30362 - IEEE 1588 & Synchronous Ethernet Packet Clock Network Synchronizer
    • Power over Ethernet (PoE)
      • Up to 48W of power
      • Power supply module required: PowerDsine 9501G Power over Ethernet Midspan Family (not supplied)
    • Precision ADC (Analog to Digital Converter)
      • 16-bit, 500 kSPS, 8 Channel, single-ended for mixed signal power management
    • DDR/SDRAM
      • 512 MB of DDR3 memory on-board
        • 256 MB for ECC
      • 16MB of SDRAM
    • eMMC
      • 4GB NAND Flash Memory
    • SPI Flash
      • 8MB Modules
  • Interfaces/Connectors
    • JTAG interface for Microsemi's FlashPro4 Programming and Cortex-M3
    • Embedded Trace Macro connector
    • USB 2.0 On-The-Go (OTG) Controller
    • RS232 port for USB-to-UART connection
    • Two DB9 connectors for CAN ports
    • RJ45 connector for PoE (Power over Ethernet) power.
    • Two RJ45 connectors for TSE Ethernet operation or SGMII mode
    • SERDES Interfaces Include
      • X4 PCIe Gen1/Gen2 Edge Fingers
      • 4 Tx/Rx High Speed SMP Connectors
      • FMC Header supporting 4 SERDES Channels
    • High Speed Memory Interface supporting LPDDR, DDR2, DDR3 and SDRAM memories
    • FMC header for daughter card support
    • GPIO header for debugging purpose
    • I2C headers
    • SPI headers

Quantity Description

  1. SmartFusion2 Development Board with M2S050T-1FGG896
  2. FlashPro4 Programmer
  3. USB A to MicroB Cable
  4. USB MicroA to A Cable
  5. USB A to Mini-B Cable
  6. PCI Edge Card Ribbon Cable
  7. 12V Power Adapter

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