Datasheet MCP6421, MCP6422, MCP6424 (Microchip)
| Manufacturer | Microchip |
| Description | The Microchip’s MCP6421/2/4 operational amplifiers (op amps) has low input bias current (1 pA, typical) and rail-to-rail input and output operation |
| Pages / Page | 46 / 1 — MCP6421/2/4. 4.4 µA/Amplifier, 90 kHz Op Amp. Features:. Description:. • … |
| File Format / Size | PDF / 3.9 Mb |
| Document Language | English |
MCP6421/2/4. 4.4 µA/Amplifier, 90 kHz Op Amp. Features:. Description:. • Low Quiescent Current:. • Low Input Offset Voltage:
Model Line for this Datasheet
Text Version of Document
MCP6421/2/4 4.4 µA/Amplifier, 90 kHz Op Amp Features: Description: • Low Quiescent Current:
The Microchip Technology Inc. MCP6421/2/4 family of - 4.4 µA/amplifier (typical) operational amplifiers operate with a single supply voltage as low as 1.8V, while drawing low quiescent
• Low Input Offset Voltage:
current per amplifier (5.5 µA, maximum). This family - ±1.0 mV (maximum) also has low-input offset voltage (±1.0 mV, maximum)
• Enhanced EMI Protection:
and rail-to-rail input and output operation. In addition, - Electromagnetic Interference Rejection Ratio the MCP6421/2/4 family is unity gain stable and has a (EMIRR) at 1.8 GHz: 97 dB gain bandwidth product of 90 kHz (typical). This • Supply Voltage Range: 1.8V to 5.5V combination of features supports battery-powered and portable applications. The MCP6421/2/4 family has • Gain Bandwidth Product: 90 kHz (typical) enhanced EMI protection to minimize any • Rail-to-Rail Input/Output electromagnetic interference from external sources. • Slew Rate: 0.05 V/µs (typical) This feature makes it well suited for EMI sensitive • Unity Gain Stable applications such as power lines, radio stations, and • No Phase Reversal mobile communications, etc. • Small Packages: The MCP6421/2/4 family is offered in single - Singles in SC70-5, SOT-23-5 (MCP6421), dual (MCP6422) and quad (MCP6424) - Dual in MSOP-8, SOIC-8 packages. All devices are designed using an advanced - Quad in SOIC-14, TSSOP-14 CMOS process and fully specified in extended temperature range from -40°C to +125°C. • Extended Temperature Range: - -40°C to +125°C
Typical Application Applications:
VDD VDD R3 R+¨R R-¨R
MCP6421
100k • Portable Medical Instruments - • Safety Monitoring + R1 VDD • Battery-Powered Systems 1k Vb - VOUT • Remote Sensing Va + • Supply Current Sensing VDD R2
MCP6421
• Analog Active Filters 1k R5 - + 100k
Design Aids:
R-¨R R+¨R
MCP6421
• SPICE Macro Models V = V – V 100k -------- • FilterLab® Software OUT a b 1k • Microchip Advanced Part Selector (MAPS)
Strain Gauge
• Analog Demonstration and Evaluation Boards • Application Notes
Package Types MCP6421 MCP6422 MCP6424
SC70-5, SOT-23-5 MSOP, SOIC SOIC, TSSOP V 1 14 VOUTD V OUTA 1 5 V VOUTA 1 8 VDD OUT DD 2 13 V V V 2 7 V INA– IND– V 2 INA– OUTB SS V 3 12 V V INA+ IND+ INA+ 3 6 VINB– V 3 4 V V 4 11 V IN+ IN– V 4 5 DD SS SS VINB+ VINB+ 5 10 VINC+ VINB– 6 9 VINC– VOUTB 7 8 VOUTC 2013 Microchip Technology Inc. DS20005165B-page 1 Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
The Microchip Technology Inc. MCP6421/2/4 family of - 4.4 µA/amplifier (typical) operational amplifiers operate with a single supply voltage as low as 1.8V, while drawing low quiescent
• Low Input Offset Voltage:
current per amplifier (5.5 µA, maximum). This family - ±1.0 mV (maximum) also has low-input offset voltage (±1.0 mV, maximum)
• Enhanced EMI Protection:
and rail-to-rail input and output operation. In addition, - Electromagnetic Interference Rejection Ratio the MCP6421/2/4 family is unity gain stable and has a (EMIRR) at 1.8 GHz: 97 dB gain bandwidth product of 90 kHz (typical). This • Supply Voltage Range: 1.8V to 5.5V combination of features supports battery-powered and portable applications. The MCP6421/2/4 family has • Gain Bandwidth Product: 90 kHz (typical) enhanced EMI protection to minimize any • Rail-to-Rail Input/Output electromagnetic interference from external sources. • Slew Rate: 0.05 V/µs (typical) This feature makes it well suited for EMI sensitive • Unity Gain Stable applications such as power lines, radio stations, and • No Phase Reversal mobile communications, etc. • Small Packages: The MCP6421/2/4 family is offered in single - Singles in SC70-5, SOT-23-5 (MCP6421), dual (MCP6422) and quad (MCP6424) - Dual in MSOP-8, SOIC-8 packages. All devices are designed using an advanced - Quad in SOIC-14, TSSOP-14 CMOS process and fully specified in extended temperature range from -40°C to +125°C. • Extended Temperature Range: - -40°C to +125°C
Typical Application Applications:
VDD VDD R3 R+¨R R-¨R
MCP6421
100k • Portable Medical Instruments - • Safety Monitoring + R1 VDD • Battery-Powered Systems 1k Vb - VOUT • Remote Sensing Va + • Supply Current Sensing VDD R2
MCP6421
• Analog Active Filters 1k R5 - + 100k
Design Aids:
R-¨R R+¨R
MCP6421
• SPICE Macro Models V = V – V 100k -------- • FilterLab® Software OUT a b 1k • Microchip Advanced Part Selector (MAPS)
Strain Gauge
• Analog Demonstration and Evaluation Boards • Application Notes
Package Types MCP6421 MCP6422 MCP6424
SC70-5, SOT-23-5 MSOP, SOIC SOIC, TSSOP V 1 14 VOUTD V OUTA 1 5 V VOUTA 1 8 VDD OUT DD 2 13 V V V 2 7 V INA– IND– V 2 INA– OUTB SS V 3 12 V V INA+ IND+ INA+ 3 6 VINB– V 3 4 V V 4 11 V IN+ IN– V 4 5 DD SS SS VINB+ VINB+ 5 10 VINC+ VINB– 6 9 VINC– VOUTB 7 8 VOUTC 2013 Microchip Technology Inc. DS20005165B-page 1 Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
