Datasheet MCP6421, MCP6422, MCP6424 (Microchip) - 7

MCP6421/2/4 2.0 TYPICAL PERFORMANCE CURVES Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/2, VOUT = VDD/2, VL = VDD/2, RL = 100 k to VL and CL = 30 pF.
48% 1000 44% 800 T = +125°C 40% A 1253Samples T = +85°C A 36% V = 3.0V (μV) 600 DD T = +25°C A 32% V = V /4 CM DD 400 T = -40°C A 28% ltage 200 o 24% 0 20% 16% -200 ntage of Occurences 12% e -400 t Offset V V = 5 5 . V 5V DD 8% -600 Representative Part Perc 4% Inpu -800 0% 0 -1000 -800 -600 -400 -200 200 400 600 800 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -1000 1000 Input Offset Voltage (μV) Common Mode Input Voltage (V) FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage vs. Common Mode Input Voltage.
10% 1000 346 Samples 800 8% V = 3.0V DD Representative Part (μV) 600 V = V /4 CM DD T = -40°C to +125°C 400 A V = 5.5V DD 6% ltage 200 o V = 1.8V DD 0 4% -200 -400 t Offset V 2% -600 Percentage of Occurances Inpu -800 0% -1000 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Input Offset Voltage Drift (μV/°C) Output Voltage (V) FIGURE 2-2:
Input Offset Voltage Drift.
FIGURE 2-5:
Input Offset Voltage vs. Output Voltage.
1000 1000 800 800 Representative Part T = +125°C A (μV) 600 T = +85°C 600 A 400 T = +25°C A 400 T = -40°C ltage A 200 o ltage (μV) 200 o 0 0 -200 -200 -400 T = +125°C 125 C t Offset V Offset V A O -400 T = +85°C A -600 -600 T = +25°C A Inpu V = 1.8V -800 DD Input T = -40°C A Representative Part -800 -1000 -1000 -0.3 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 Common Mode Input Voltage (V) Power Supply Voltage (V) FIGURE 2-3:
Input Offset Voltage vs.
FIGURE 2-6:
Input Offset Voltage vs. Common Mode Input Voltage. Power Supply Voltage.  2013 Microchip Technology Inc. DS20005165B-page 7 Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service