Datasheet ADA4853-1, ADA4853-2, ADA4853-3 (Analog Devices) - 7

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Data Sheet ADA4853-1/ADA4853-2/ADA4853-3 ABSOLUTE MAXIMUM RATINGS Table 3.
The power dissipated in the package (PD) for a sine wave and a
Parameter Rating
resistor load is the total power consumed from the supply minus the load power. Supply Voltage 5.5 V Power Dissipation See Figure 6 PD = Total Power Consumed − Load Power Common-Mode Input Voltage −VS − 0.2 V to +VS − 1.2 V V 2 = × D P ( SVUPPLYVOLTAGE ISUPPLYCURRENT) Differential Input Voltage ±V OUT – S R Storage Temperature Range −65°C to +125°C L Operating Temperature Range RMS output voltages should be considered. 6-Lead SC70 −40°C to +85°C Airflow increases heat dissipation, effectively reducing θJA. 16-Lead LFCSP_WQ −40°C to +105°C In addition, more metal directly in contact with the package 14-Lead TSSOP −40°C to +105°C leads and through holes under the device reduces θJA. Lead Temperature JEDEC J-STD-20 Figure 6 shows the maximum safe power dissipation in the Junction Temperature 150°C package vs. the ambient temperature for the 6-lead SC70 Stresses above those listed under Absolute Maximum Ratings (430°C/W), the 14-lead TSSOP (120°C/W), and the 16-lead may cause permanent damage to the device. This is a stress LFCSP_WQ (63°C/W) on a JEDEC standard 4-layer board. θJA rating only; functional operation of the device at these or any values are approximations. other conditions above those indicated in the operational
3.0
section of this specification is not implied. Exposure to absolute
)
maximum rating conditions for extended periods may affect
2.5 (W
device reliability.
N IO T 2.0 THERMAL RESISTANCE PA LFCSP ISSI
θ
D
JA is specified for the worst-case conditions, that is, θJA is
1.5 ER
specified for the device soldered in the circuit board for
W TSSOP
surface-mount packages.
M PO 1.0 MU Table 4. XI MA 0.5 Package Type θJA Unit SC70
6-Lead SC70 430 °C/W
0
16-Lead LFCSP_WQ 63 °C/W
–55 –35 –15 5 25 45 65 85 105 125
059
AMBIENT TEMPERATURE (°C)
14-Lead TSSOP 120 °C/W 05884- Figure 6. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
Maximum Power Dissipation ESD CAUTION
The maximum safe power dissipation for the ADA4853-1/ ADA4853-2/ADA4853-3 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a junction temperature of 150°C for an extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality. Rev. G | Page 7 of 20 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS SPECIFICATIONS WITH 3 V SUPPLY SPECIFICATIONS WITH 5 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS CIRCUIT DESCRIPTION HEADROOM CONSIDERATIONS OVERLOAD BEHAVIOR AND RECOVERY Input APPLICATIONS INFORMATION SINGLE-SUPPLY VIDEO AMPLIFIER POWER SUPPLY BYPASSING LAYOUT OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS